Co-Packaged Optics Testing Faces Steep Data Center Ramp


Key Takeaways: Device interface board must balance flexibility in handling with customization for different optical connectors. Test fixtures should account for DUT socketing challenges, such as warpage, coupling, and interference. Advanced data management practices will help speed yield learning. Integrating photonic and electrical ICs into co-packaged optics (CPO) requires... » read more

From Silos to Systems, from Data to Insight


The semiconductor industry is experiencing unprecedented growth in complexity, scale, and data volume. Engineering organizations are managing larger and longer-running projects, integrating more diverse methodologies, and relying on an expanding ecosystem of specialized tools. At the same time, they face increasing demands for compliance, traceability, security, and data sovereignty. In this en... » read more

Breaking The Legacy Trap: How Semiconductor Executives Can Accelerate AI Adoption And Transform IT Applications At The Same Time


The semiconductor industry is facing a strategic paradox. AI has rapidly moved from experimental technology to a competitive necessity promising faster yield improvement, smarter supply chain decisions, and autonomous factory operations. Yet the very systems that semiconductor manufacturers depend on to run their fabs, manage their supply chains, and serve their customers were built for a diffe... » read more

AI Design Reshapes Data Management


Key takeaways: Integrating AI into chip workflows is pushing companies to overhaul their data management strategies, shifting from passive storage to active, structured, and machine-readable systems. As training and inference workloads grow, data movement, congestion, and energy efficiency become the dominant challenges, often surpassing raw compute capability. Proprietary and comple... » read more

Challenges In Moving Data In Chips


The number of processes running simultaneously inside of chips is growing, fueled by massive increases in data from AI and sensors everywhere. The challenge now, particularly in multi-die assemblies, is how to prioritize where signals go, how quickly they move, and when they're supposed to arrive at shared memories. Andy Nightingale, vice president of product management and marketing at Arteris... » read more

Transforming Data Management In EDA: Preparing For The AI Era


In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential. Growing design complexity, distributed teams, and the accelerating adoption of AI/ML are pushing organizations to rethink how they manage, track, and leverage decades of engineering data. From manual workarounds to data management Many engineers discover the importance ... » read more

Tracing The Equipment Connectivity Journey


The semiconductor industry has undergone a dramatic transformation from the early days of manual integration to today's AI-driven collaboration with equipment connectivity at the heart of this evolution. Understanding these trends is crucial for any organization looking to leverage data for improved efficiency, reliability, and competitive advantage. This blog explores milestones and emergin... » read more

IP And Data Management: Challenges, Solutions, And Best-in-Class Approaches


As electronic design becomes increasingly complex, traditional approaches to IP and design data management are reaching their limits. Fragmented systems, inconsistent documentation, and unclear version control are slowing collaboration, increasing rework, and ultimately constraining innovation. The ability to manage design data effectively is no longer a background concern — it’s a foundati... » read more

Collaboration Is Key To Growing Semiconductor Industry


John Kibarian, CEO and co-founder of PDF Solutions and a member of the ESD Alliance (ESDA) Governing Council, will deliver a keynote during the CEO Summit at SEMICON West in October titled “Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms.” He recently shared with me a summary of what his talk will cover and his perspective on why collabora... » read more

Data Feed Forward And How It Works: Part 2


As chiplets and advanced packaging redefine semiconductor architecture, managing complexity isn’t just about the silicon—it’s about the data. Modern multi-die packages often contain components from different vendors, integrated in 2.5D or 3D configurations. Each die brings its own risks, and diagnosing issues after assembly is increasingly difficult—especially when data isn’t share... » read more

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