Cybersecurity Risks Of Automotive OTA

By John Koon - 01 Dec, 2022 - Comments: 0

Modern vehicles increasingly resemble supercomputers on wheels, with many electronic control units (ECUs) networked together as increasingly sophisticated software is installed and updated. Similar to smartphones, vehicle OEMs will contact vehicle owners remotely about operating system updates that add new features and/or fixes, as well as software bugs and vulnerabilities. But all of this h... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 31 Jan, 2020 - Comments: 0

AI/Edge Brewer Science is introducing its first material for permanent bond used in assembling ICs, image sensor devices, and MEMS for devices and packaging that “include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movement after cure,” according to a press release. The bond is part of the PermaSOL product family. “These hi... » read more

LiDAR Goes Back To The Future

By Jeff Dorsch - 12 Mar, 2018 - Comments: 0

LiDAR is emerging as an increasingly important piece of the enabling technology in autonomous driving, along with advanced computer vision and radar sensor chips. But LiDAR systems also are finding their way into a variety of other applications, such as industrial automation, including robotics, and unmanned aerial vehicles. Advanced mapping is another rapidly growing market for LiDAR, which... » read more

The Road To Autonomy

By Jeff Dorsch - 01 Feb, 2018 - Comments: 0

Visions of autonomous driving were everywhere at CES 2018 in Las Vegas and the North American International Auto Show in Detroit. Still, while there is progress in the technology, it will be years before the average motorist can get a fully autonomous vehicle. Advanced driver-assistance systems are gaining in complexity and scope, representing steps toward automated driving. At CES 2018, ... » read more

LiDAR Market Continues To Percolate

By Jeff Dorsch - 13 Sep, 2017 - Comments: 0

Light imaging, detection, and ranging (LiDAR) sensors are still dazzling investors and technologists. They are chasing after the technology for automotive applications, while also keeping an eye on LiDAR for drones, industrial automation, mapping, and robotics, among other uses. It’s too early to tell how market share for automotive LiDAR is shaping up, as the bigger vendors are still work... » read more

LiDAR Completes Sensing Triumvirate

By Jeff Dorsch - 06 Apr, 2017 - Comments: 3

Fully autonomous vehicles of the future will depend on a combination of different sensing technologies – advanced vision systems, radar, and light imaging, detection, and ranging (LiDAR). Of the three, LiDAR is now the costliest part of that equation, and there are worldwide efforts to bring down those costs. Mechanical LiDAR units are currently available, priced in the hundreds of dollars... » read more

The Week In Review: IoT

By Jeff Dorsch - 02 Dec, 2016 - Comments: 0

Management Intel has hired Tom Lantzsch, the executive vice president of strategy at ARM Holdings, to serve as senior vice president and general manager of its IoT Group, effective in January. Lantzsch succeeds Douglas Davis, a senior vice president who was running the IoT Group and had announced plans to retire from Intel after more than 30 years. Davis reconsidered that move, however; he wil... » read more

Week 50: It’s Not Just A Technical Conference, It’s An Ecosystem

By Anne Cirkel - 22 May, 2015 - Comments: 0

While our free “I love DAC” registration comes to an end this week, there are still a few weeks left to register for the full conference, the designer and IP track, or one of the many co-located events at DAC (see below). Over the last year I’ve been reminded often about the unique niche occupied by DAC. Just last week a good friend was trying to find an industry event in the greater EDA ... » read more

Week 35: Automotive At DAC

By Anne Cirkel - 06 Feb, 2015 - Comments: 0

With my adopted hometown preparing for the Portland Auto Show, I thought it an opportune time to revisit automotive at DAC. Scanning the news releases, it seems that here in Portland the focus will be on things like horsepower, handling and, of course, design — the usual fare for an auto show. In contrast at DAC, we’ll be talking about the rapid increase in content and complexity that has m... » read more

The Week In Review: Design

By Ed Sperling - 26 Sep, 2014 - Comments: 0

Tools Synopsys rolled out a hybrid verification platform, which it said can shave months off design time. The platform acts like a bridge between emulation, FPGA prototyping, simulation, static and formal verification and debug. Mentor Graphics uncorked a new version of its embedded hypervisor, which includes better system configuration, debugging and hardware support. The hypervisor is aim... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?