Speeding Up FPGA Development

By Ed Sperling - 28 Feb, 2020 - Comments: 0

Salaheddin Hetalani, field application engineer at OneSpin Solutions, talks about why it’s getting harder to design and debug FPGAs, how much design time can be saved through formal techniques, and why just relying on programmability isn’t the most efficient approach. » read more

Synopsys FPGA Platform: Enabling Faster Design, Verification and Debug of FPGAs

By Synopsys - 11 Sep, 2019 - Comments: 0

Field programmable gate arrays (FPGAs) are no longer the co-processor of full-custom chips and application-specific integrated circuits (ASICs). Today's FPGA offerings include devices as large and complex as any ASIC system-on-chip (SoC) on the market. The dramatic increase in size, complexity and functionality means that many FPGA development teams are adopting ASIC-style design, verification ... » read more

Where Advanced Packaging Makes Sense

By Ed Sperling - 10 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Handoff Points Getting Blurry

By Ann Mutschler - 24 Nov, 2015 - Comments: 0

Whether driven by [getkc id="74" comment="Moore's Law"] or just sheer complexity, the way information is passed through the design and test flow is changing. For the past couple of process generations, there has been a concerted push by tool vendors and their customers to run more steps earlier in a flow, sometimes concurrently. While this so-called "shift left" helps to speed up software de... » read more

Tear Down The Wall Between Front-End And Back-End Teams

By Kurt Shuler - 25 Jun, 2015 - Comments: 1

As complexity of system-on-chip devices increases, it's becoming imperative for design teams and organizations to re-examine how they work with one another in order to improve productivity. One giant step in this direction is to bridge the divide between the front-end design process and the physical back-end design process. We often refer to this as a figurative “wall,” but there is real... » read more

Pressure Builds To Revamp The Design Flow

By Ed Sperling - 23 Apr, 2015 - Comments: 1

Without [getkc id="7" kc_name="EDA"] there would be no [getkc id="74" comment="Moore's Law"] as we know it today, and without Moore's Law there would be a much more limited need for EDA. But after more than three decades of developing design flows packed with sophisticated tools to automate semiconductor design through verification, and thereby enable feature shrinks that are the basis of Moore... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer