tag: DFT

Meeting ISO 26262 Requirements Using Tessent IC Test Solutions
By Mentor, a Siemens Business - 08 Jul, 2019 - Comments: 0

As the industry moves towards greater automation in vehicles, suppliers of the ICs used to drive the automotive electronic systems are rapidly adopting solutions to meet ISO 26262 requirements. The Tessent family of IC test products offers the highest defect coverage, in-system non-destructive memory test, hybrid ATPG/Logic BIST, and analog test coverage measurement. These technologies add up t... » read more

BiST Grows Up In Automotive
By Ann Mutschler - 12 Jun, 2019 - Comments: 0

Test concepts and methods that have been used for many years in traditional semiconductor and SoC design are now being leveraged for automotive chips, but they need to be adapted and upgraded to enable monitoring of advanced automotive systems during operation of a vehicle. Automotive and safety critical designs have very high quality, reliability, and safety requirements, which pairs pe... » read more

Smart Plug-And-Play DFT For Arm Cores
By Ron Press - 11 Jun, 2019 - Comments: 0

Modern SoCs are experiencing continued growth in capabilities and design sizes with more and more subsystem IPs being implemented. These large, complex, multi-core SoCs need strategies for DFT and ATPG that effectively reduce DFT effort, minimize ATPG runtime, and still achieve the target test coverage. Hierarchical DFT enables designing and testing of these designs in a systematic and repeatab... » read more

ATE Lab To Fab
By Ed Sperling - 05 Jun, 2019 - Comments: 2

Shu Li, business development manager at Advantest, zeroes in on the communication gap between engineers on the design side and the manufacturing/test side, why it exists, and what needs to be done to bridge that gap in order to speed up and improve test quality. https://youtu.be/Nd-5_twbJBw     See other tech talk videos here » read more

Making AI More Dependable
By Ed Sperling - 07 May, 2019 - Comments: 0

Ira Leventhal, vice president of Advantest’s new concept product initiative, looks at why AI has taken so long to get going, what role it will play in improving the reliability of all chips, and how to use AI to improve the reliability of AI chips themselves. » read more

Automotive, AI Drive Big Changes In Test
By Ann Mutschler - 25 Apr, 2019 - Comments: 0

Design for test is becoming enormously more challenging at advanced nodes and in increasingly heterogeneous designs, where there may be dozens of different processing elements and memories. Historically, test was considered a necessary but rather mundane task. Much has changed over the past year or so. As systemic complexity rises, and as the role of ICs in safety-critical markets continues ... » read more

The Precision Knob
By Ed Sperling - 18 Apr, 2019 - Comments: 0

Precision used to be a goal, but increasingly it is being used as a tool. This is true for processing and algorithms, where less precision can greatly improve both performance and battery life. And it is true in manufacturing, where more precision can help minimize the growing impact of variation. Moreover, being able to dial precision up or down can help engineers see the impact on a system... » read more

Finding The Source Of EUV Stochastic Effects
By Katherine Derbyshire - 15 Apr, 2019 - Comments: 7

The next phase of EUV development has begun—making EUV more predictable and potentially more mainstream—and it's looking to be every bit as difficult and ambitious as other developments in advanced lithography. In the early days of EUV development, supporters of the technology argued that it was “still based on photons,” as opposed to alternatives like electron beam lithography. Whil... » read more

How To Manage DFT For AI Chips
By Rahul Singhal - 09 Apr, 2019 - Comments: 0

Semiconductor companies are racing to develop AI-specific chips to meet the rapidly growing compute requirements for artificial intelligence (AI) systems. AI chips from companies like Graphcore and Mythic are ASICs based on the novel, massively parallel architectures that maximize data processing capabilities for AI workloads. Others, like Intel, Nvidia, and AMD, are optimizing existing archite... » read more

AI Chip DFT Techniques For Aggressive Time-To-Market
By Mentor, a Siemens Business - 09 Apr, 2019 - Comments: 0

AI chips have aggressive time-to-market goals. Designers can shave significant time off of DFT and silicon bring up using the techniques described in this paper. Leading AI semiconductor companies have already had success with Tessent DFT tools. To read more, click here. » read more

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