tag: DRAM

CXL and OMI: Competing or Complementary?
By Bryon Moyer - 23 Mar, 2022 - Comments: 1

System designers are looking at any ideas they can find to increase memory bandwidth and capacity, focusing on everything from improvements in memory to new types of memory. But higher-level architectural changes can help to fulfill both needs, even as memory types are abstracted away from CPUs. Two new protocols are helping to make this possible, CXL and OMI. But there is a looming question... » read more

An Energy-Efficient DRAM Cache Architecture for Mobile Platforms With PCM-Based Main Memory
By Technical Paper Link - 21 Mar, 2022 - Comments: 0

Abstract "A long battery life is a first-class design objective for mobile devices, and main memory accounts for a major portion of total energy consumption. Moreover, the energy consumption from memory is expected to increase further with ever-growing demands for bandwidth and capacity. A hybrid memory system with both DRAM and PCM can be an attractive solution to provide additional capacity ... » read more

Quantifying Rowhammer Vulnerability for DRAM Security
By Technical Paper Link - 14 Mar, 2022 - Comments: 0

Abstract: "Rowhammer is a memory-based attack that leverages capacitive-coupling to induce faults in modern dynamic random-access memory (DRAM). Over the last decade, a significant number of Rowhammer attacks have been presented to reveal that it is a severe security issue capable of causing privilege escalations, launching distributed denial-of-service (DDoS) attacks, and even runtime attack ... » read more

Benchmarking Memory-Centric Computing Systems: Analysis of Real Processing-in-Memory Hardware
By Technical Paper Link - 10 Mar, 2022 - Comments: 0

Abstract "Many modern workloads such as neural network inference and graph processing are fundamentally memory-bound. For such workloads, data movement between memory and CPU cores imposes a significant overhead in terms of both latency and energy. A major reason is that this communication happens through a narrow bus with high latency and limited bandwidth, and the low data reuse in memory-bo... » read more

SparseP: Towards Efficient Sparse Matrix Vector Multiplication on Real Processing-In-Memory Systems
By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract "Several manufacturers have already started to commercialize near-bank Processing-In-Memory (PIM) architectures. Near-bank PIM architectures place simple cores close to DRAM banks and can yield significant performance and energy improvements in parallel applications by alleviating data access costs. Real PIM systems can provide high levels of parallelism, large aggregate memory bandwi... » read more

2022 Chip Forecast: Mixed Signals
By Mark LaPedus - 22 Feb, 2022 - Comments: 0

Jim Feldhan, president of Semico Research, sat down with Semiconductor Engineering to talk about the outlook for the semiconductor market. SE: What was your final 2021 semiconductor forecast? What is your 2022 semiconductor forecast? Feldhan: For 2021, world semiconductor revenues totaled $558 billion and units totaled over 1.1 trillion units. In terms of growth rate, revenues increased 2... » read more

SOT-MRAM To Challenge SRAM
By Bryon Moyer - 13 Jan, 2022 - Comments: 1

In an era of new non-volatile memory (NVM) technologies, yet another variation is poised to join the competition — a new version of MRAM called spin-orbit torque, or SOT-MRAM. What makes this one particularly interesting is the possibility that someday it could supplant SRAM arrays in systems-on-chip (SoCs) and other integrated circuits. The key advantages of SOT-MRAM technology are the pr... » read more

Reliability Concerns Shift Left Into Chip Design
By Ann Mutschler - 22 Dec, 2021 - Comments: 1

Demand for lower defect rates and higher yields is increasing, in part because chips are now being used for safety- and mission-critical applications, and in part because it's a way of offsetting rising design and manufacturing costs. What's changed is the new emphasis on solving these problems in the initial design. In the past, defectivity and yield were considered problems for the fab. Re... » read more

Covid Masks And Forecasts At Semicon
By Mark LaPedus - 16 Dec, 2021 - Comments: 0

Semicon West 2021 was certainty different, if not surreal, this year. The annual event was held in-person from Dec. 7-9, although there is a virtual component that runs until Jan. 7, 2022. In comparison, Semicon West was an all-virtual event in 2020, due to the Covid-19 pandemic. At this year’s in-person event in San Francisco, attendees, exhibitors and speakers were all required to wea... » read more

Understanding Electrical Line Resistance At Advanced Semiconductor Nodes
By Sandy Wen - 16 Dec, 2021 - Comments: 0

When evaluating shrinking metal linewidths in advanced semiconductor devices, bulk resistivity is not the sole materials property for deriving electrical resistance. At smaller line dimensions, local resistivity is dominated by grain boundary effects and surface scattering. Consequently, resistivity varies throughout a line, and resistance extraction needs to account for these secondary phenome... » read more

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