tag: DRAM

Uncovering The Size, Structure, And Operation Of DRAM Subarrays And Showing Experimental Results Supporting The Cause Of Rowhammer
By Technical Paper Link - 14 Jun, 2023 - Comments: 0

A technical paper titled “X-ray: Discovering DRAM Internal Structure and Error Characteristics by Issuing Memory Commands” was published by researchers at Seoul National University and University of Illinois at Urbana-Champaign. Abstract: "The demand for accurate information about the internal structure and characteristics of dynamic random-access memory (DRAM) has been on the rise. Recen... » read more

A PIM Architecture That Supports Floating Point-Precision Computations Within The Memory Chip
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “FlutPIM: A Look-up Table-based Processing in Memory Architecture with Floating-point Computation Support for Deep Learning Applications” was published by researchers at Rochester Institute of Technology and George Mason University. Abstract: "Processing-in-Memory (PIM) has shown great potential for a wide range of data-driven applications, especially Deep Learnin... » read more

Rowhammer Vulnerability Of A HBM2 DRAM Chip
By Technical Paper Link - 01 Jun, 2023 - Comments: 0

A new technical paper titled "An Experimental Analysis of RowHammer in HBM2 DRAM Chips" was published by researchers at ETH Zurich and American University of Beirut. Abstract: "RowHammer (RH) is a significant and worsening security, safety, and reliability issue of modern DRAM chips that can be exploited to break memory isolation. Therefore, it is important to understand real DRAM chips' ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 26 May, 2023 - Comments: 1

The Cyberspace Administration of China recommended a ban of Micron chips for critical information infrastructure (CII), alleging serious network security risks. According to a statement from China's Network Security Review Office, "Micron's products have relatively serious potential network security issues, which pose a major security risk to [China's] critical information infrastructure supply... » read more

Memory Disaggregation Research And Making It Practical With Hardware Trends (U. of Michigan)
By Technical Paper Link - 22 May, 2023 - Comments: 0

A new technical paper titled "Memory Disaggregation: Advances and Open Challenges" was published by researchers at University of Michigan. Abstract "Compute and memory are tightly coupled within each server in traditional datacenters. Large-scale datacenter operators have identified this coupling as a root cause behind fleet-wide resource underutilization and increasing Total Cost of Owners... » read more

Etch Processes Push Toward Higher Selectivity, Cost Control
By Laura Peters - 18 May, 2023 - Comments: 0

Plasma etching is perhaps the most essential process in semiconductor manufacturing, and possibly the most complex of all fab operations next to photolithography. Nearly half of all fab steps rely on a plasma, an energetic ionized gas, to do their work. Despite ever-shrinking transistor and memory cells, engineers continue to deliver reliable etch processes. “To sustainably create chips... » read more

GDDR6 Delivers The Performance For AI/ML Inference
By Frank Ferro - 15 May, 2023 - Comments: 0

AI/ML is evolving at a lightning pace. Not a week goes by right now without some new and exciting developments in the field, and applications like ChatGPT have brought generative AI capabilities firmly to the forefront of public attention. AI/ML is really two applications: training and inference. Each relies on memory performance, and each has a unique set of requirements that drive the choi... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 12 May, 2023 - Comments: 0

Global semiconductor sales reached $574 billion in 2022, and U.S. semiconductor companies accounted for sales totaling $275 billion, or 48% of the global market, according to the 2023 Factbook released by the Semiconductor Industry Association (SIA). DRAM and NAND prices likely will continue to fall further this quarter because production cuts have not kept pace with weakening demand, accord... » read more

3D Structures Challenge Wire Bond Inspection
By Karen Heyman - 09 May, 2023 - Comments: 1

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it remains the bonding approach of choice for a broad swath of applications. This is particularly evident in automotive, industrial, and many consumer applications, where the majority of chips are not de... » read more

State of the Art And Future Directions of Rowhammer (ETH Zurich)
By Technical Paper Link - 18 Apr, 2023 - Comments: 0

A new technical paper titled "Fundamentally Understanding and Solving RowHammer" was published by researchers at ETH Zurich. Abstract "We provide an overview of recent developments and future directions in the RowHammer vulnerability that plagues modern DRAM (Dynamic Random Memory Access) chips, which are used in almost all computing systems as main memory. RowHammer is the phenomenon in... » read more

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