High-Performance DSP And Control Processing For Complex 5G Requirements


In the early 2000s, digital signal processors (DSP) were simple in architecture and limited in performance, but complex in programming. However, they evolved to meet of the increased performance requirements of 3G cellular baseband modem applications. A typical 3G modem system would have a single DSP optimized for dual/quad SIMD MAC performance with basic DSP filter instructions like Fast Fouri... » read more

Why Scaling Must Continue


The entire semiconductor industry has come to the realization that the economics of scaling logic are gone. By any metric—price per transistor, price per watt, price per unit area of silicon—the economics are no longer in the plus column. So why continue? The answer is more complicated than it first appears. This isn't just about inertia and continuing to miniaturize what was proven in t... » read more

Powering The Edge: Driving Optimal Performance With the Arm ML Processor


On-device machine learning (ML) processing is already happening in more than 4 billion smart phones. As the adoption of connected devices continues to grow exponentially, the resulting data explosion means cloud processing could soon become an expensive and high-latency luxury. The Arm ML processor is defining the future of ML inference at the edge, allowing smart devices to make independent... » read more

Using Compression For High-Bandwidth Video


Malte Doerper, senior manager for product management at Synopsys, explains how to improve bandwidth and reduce latency in video without changing out the existing infrastructure through compression, but unlike previous versions of compression there is no significant loss of quality. This approach reduces power, area and heat, as well. » read more

Say Welcome to the Machine: Low-Power Machine Learning for Smart IoT Applications


By Pieter van der Wolf, Principal R&D Engineer, Synopsys Inc. and Dmitry Zakharov, Senior Software Engineer, Synopsys Inc Smart IoT devices that interact intelligently with their users are appearing in many application areas. Increasingly, these devices apply machine learning technology for processing captured sensor data, so that smart actions can be taken based on recognized patterns. ... » read more

Aspinity’s Analog Neural Net Wake-Up Call


Putting an analog chip in front of an always-on system for digitizing speech and having the analog chip listen for sounds of interest may help avoid huge power waste and data congestion in current voice-recognition systems. Aspinity, an analog neuromorphic semiconductor startup, has worked the problem and just announced its Reconfigurable Analog Modular Processor (RAMP) platform yesterday. RAMP... » read more

CEO Outlook: It Gets Much Harder From Here


Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

SLAM And DSP Implementation


With the introduction of simultaneous localization and mapping technology, or SLAM, there comes a need for more sophisticated DSPs to handle the required computations. To address this need, Cadence has introduced the Tensilica Vision Q7 DSP to handle the requirements of SLAM, including high performance, low power, and with an ease of development that engineers can leverage to design new and exc... » read more

Driving AI, ML To New Levels On MCUs


One of the most dramatic impacts of technology of late has been the implementation of artificial intelligence and machine learning on small edge devices, the likes of which are forming the backbone of the Internet of Things. At first, this happened through sheer engineering willpower and innovation. But as the drive towards a world of a trillion connected devices accelerates, we must find wa... » read more

IP Requires System Context At 6/5/3nm


Driven by each successive generation of semiconductor manufacturing technology, complexity has reached dizzying levels. Every part of the design, verification and manufacturing is more complicated and intense the more transistors are able to be packed onto a die. For these reasons, the entire system must be taken into consideration as a whole – not just as individual building blocks as could ... » read more

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