Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Mar, 2020 - Comments: 0

Pervasive computing — health An injectable biosensor may someday help measure signs of influenza. DARPA (the U.S. Department of Defense’s Defense Advanced Research Projects Agency) and digital health startup Profusa announced a study that uses Profusa’s Lumee Oxygen Platform to find ways to identify flu outbreaks, biological attacks and pandemics as much as three weeks earlier than curre... » read more

System Bits: Oct. 9

By Jeff Dorsch - 09 Oct, 2019 - Comments: 0

Bringing plasmonic color to solid materials Researchers at the University of California, Riverside, used silver nanoparticles (AgNPs) to produce plasmonic color-switchable films for solid materials. This effect was previously achieved only in liquids. Rapid and reversible tuning of plasmonic color in solid films, a challenge until now, holds great promise for a number of applications,” sa... » read more

Manufacturing Bits: May 28

By Mark LaPedus - 28 May, 2019 - Comments: 0

Swarming autonomous blimps The U.S. Naval Research Laboratory (NRL) is exploring the development of miniature autonomous blimps, a technology that could pave the way towards a new form of military swarming technology. Initially, NRL developed 30 miniature autonomous blimps. The goal is to test the interaction and swarming behavior of these autonomous systems. Georgia Institute of Technology... » read more

Power/Performance Bits: May 21

By Jesse Allen - 21 May, 2019 - Comments: 0

More speculative vulnerabilities Security researchers at the Graz University of Technology, KU Leuven, Cyberus Technology, and Worcester Polytechnic Institute point to two new speculative execution vulnerabilities related to Meltdown and Spectre. The first, which they dubbed ZombieLoad, uses a similar approach to Meltdown. After preparing tasks in parallel, the processor needs to discard th... » read more

Manufacturing Bits: Dec. 26

By Mark LaPedus - 26 Dec, 2018 - Comments: 0

Polymer pen litho Using a polymer pen lithography technique, the Air Force Research Laboratory and Northwestern University have developed a quick way to discover new materials. Researchers have developed a combinatorial library of tiny nanoparticles on a substrate. A combinatorial library, sometimes referred to as a megalibrary, is a collection of different structures. Each structure is enc... » read more

Power/Performance Bits: Nov. 6

By Jesse Allen - 06 Nov, 2018 - Comments: 0

Camera for object recognition Researchers from the University of Illinois at Urbana-Champaign developed a new camera that could improve object detection in vehicles. Inspired by the visual system of mantis shrimp, the camera detects the polarization of light and has a dynamic range about 10,000 times higher than today's commercial cameras. "In a recent crash involving a self-driving car, th... » read more

System Bits: Oct. 17

By Ann Mutschler - 17 Oct, 2017 - Comments: 0

Piezoelectric, ingestible sensors With an aim to help doctors diagnose gastrointestinal disorders that slow down the passage of food through the digestive tract, MIT and Brigham and Women’s Hospital researchers have built a flexible sensor that can be rolled up and swallowed. Once ingested, the sensor adheres to the stomach wall or intestinal lining, where it can measure the rhythmic con... » read more

System Bits: Sept. 19

By Ann Mutschler - 19 Sep, 2017 - Comments: 0

Novel quantum computing architecture invented University of New South Wales researchers have invented what they say is a radical new architecture for quantum computing, based on ‘flip-flop qubits,’ that promises to make the large-scale manufacture of quantum chips dramatically easier. [caption id="attachment_319384" align="alignnone" width="300"] Artist's impression of flip-flop qubit e... » read more

Power/Performance Bits: April 18

By Jesse Allen - 18 Apr, 2017 - Comments: 0

Cooling hotspots Engineers at Duke University and Intel developed a technology to cool hotspots in high-performance electronics. The new technology relies on a vapor chamber made of a super-hydrophobic floor with a sponge-like ceiling. When placed beneath operating electronics, moisture trapped in the ceiling vaporizes beneath emerging hotspots. The vapor escapes toward the floor, taking hea... » read more

System Bits: April 11

By Ann Mutschler - 11 Apr, 2017 - Comments: 0

Tiny transistors made from self-assembled carbon nanotubes While carbon nanotubes can be used to make very small electronic devices, they are difficult to handle. Now, researchers from the University of Groningen, the University of Wuppertal, and IBM Zurich, have developed a method to select semiconducting nanotubes from a solution, and make them self-assemble on a circuit of gold electrodes. ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?