tag: e-beam inspection

Improving Yield With Machine Learning
By Laura Peters - 12 Jul, 2022 - Comments: 0

Machine learning is becoming increasingly valuable in semiconductor manufacturing, where it is being used to improve yield and throughput. This is especially important in process control, where data sets are noisy. Neural networks can identify patterns that exceed human capability, or perform classification faster. Consequently, they are being deployed across a variety of manufacturing proce... » read more

Novel E-Beam Techniques For Inspection And Monitoring
By PDF Solutions - 09 May, 2022 - Comments: 0

In this paper, we report an advanced e-beam defect inspection tool (eProbe®250) and the Design-for-Inspection™ (DFI) system that has been built and deployed by PDF Solutions down to 4nm FinFET technology nodes. This tool has a very high throughput which allows for in-line inspection of nanometer-level defects in the most advanced technology nodes. We also present eProbe applications for... » read more

Finding, Predicting EUV Stochastic Defects
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Several vendors are rolling out next-generation inspection systems and software that locates problematic defects in chips caused by processes in extreme ultraviolet (EUV) lithography. Each defect detection technology involves various tradeoffs. But it’s imperative to use one or more of them in the fab. Ultimately, these so-called stochastic-induced defects caused by EUV can impact the perf... » read more

Speeding Up The R&D Metrology Process
By Mark LaPedus - 16 Jul, 2020 - Comments: 0

Several chipmakers are making some major changes in the characterization/metrology lab, adding more fab-like processes in this group to help speed up chip development times. The characterization/metrology lab, which is generally under the radar, is a group that works with the R&D organization and the fab. The characterization lab is involved in the early analytical work for next-generati... » read more

Controlling Variability And Cost At 3nm And Beyond
By Ed Sperling - 22 May, 2019 - Comments: 1

Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the migration to new process nodes, and advancements in ALE and materials that could have a big impact on controlling costs. What follows are excerpts of that conversation. SE: As more sensors are added int... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Apr, 2019 - Comments: 0

Chipmakers Here comes the battle between 5nm and 6nm processes at two foundry vendors—Samsung and TSMC. Meanwhile, Intel is behind and scrambling to get 10nm out the door. (Intel's 10nm is equivalent to 7nm from the foundries.) Last week, TSMC announced delivery of a complete version of its 5nm design infrastructure. TSMC’s 5nm technology is based on a finFET. This week, Samsung anno... » read more

EUV Mask Readiness Challenges
By Mark LaPedus - 21 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and photomask technologies with Emily Gallagher, principal member of the technical staff at Imec; Harry Levinson, principal at HJL Lithography; Chris Spence, vice president of advanced technology development at ASML; Banqiu Wu, senior director of process development at Applied Materials; and Aki Fujimura, chief ... » read more

E-Beam Review And CD Measurement Revolutionizes Display Yield Management
By Applied Materials - 20 Mar, 2019 - Comments: 0

Fundamental changes are occurring in the display industry, driven by demands for higher-resolution screens and other capabilities for both mobile and TV applications. To meet these demands, the display technology roadmap in this article calls for innovations in materials, processes and device technology. Critical requirements include smaller design rules and the adoption of a range of materi... » read more

E-beam Inspection Makes Inroads
By Mark LaPedus - 18 Jan, 2018 - Comments: 4

E-beam inspection is gaining traction in critical areas in fab production as it is becoming more difficult to find tiny defects with traditional methods at advanced nodes. Applied Materials, ASML/HMI and others are developing new e-beam inspection tools and/or techniques to solve some of the more difficult defect issues in the fab. [gettech id="31057" t_name="E-beam"] inspection is one of tw... » read more

Inside Photomask Writing
By Mark LaPedus - 19 Jan, 2017 - Comments: 0

Hirokazu Yamada, a board member and the director of the Mask Lithography Division of NuFlare, sat down with Semiconductor Engineering to discuss photomask technology, e-beam mask writer trends and other topics. NuFlare is the world’s largest supplier of e-beam mask writers. What follows are excerpts of that conversation. SE: How does the [getkc id="265" kc_name="photomask"] market look in... » read more

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