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Power/Performance Bits: June 7


Commercializing photonic MEMS Researchers from the University of California Berkeley, Daegu Gyeongbuk Institute of Science & Technology, SUSS MicroOptics, TSI Semiconductors, Gwangju Institute of Science and Technology, KAIST, Ecole Polytechnique Fédérale de Lausanne (EPFL), and Korea Polytechnic University demonstrated a path for commercial fabrication of photonic MEMS. Photonic MEMS... » read more

Power/Performance Bits: May 18


Efficient high-voltage power conversion Researchers from École Polytechnique Fédérale de Lausanne (EPFL) and Enkris Semiconductor are working to design new power transistors with the aim of improving power converter efficiency. "We see examples of electric power losses every day, such as when the charger of your laptop heats up," said Elison Matioli, head of EPFL's POWERlab, noting that ... » read more

Power/Performance Bits: Dec. 7


Logic-in-memory with MoS2 Engineers at École Polytechnique Fédérale de Lausanne (EPFL) built a logic-in-memory device using molybdenum disulfide (MoS2) as the channel material. MoS2 is a three-atom-thick 2D material and excellent semiconductor. The new chip is based on floating-gate field-effect transistors (FGFETs) that can hold electric charges for long periods. MoS2 is particularly se... » read more

Power/Performance Bits: Nov. 9


Integrated transistor cooling Researchers at Ecole Polytechnique Fédérale de Lausanne (EPFL) created a single chip that combines a transistor and microfluidic cooling system for more efficient transistor heat management. The team focused on a co-design approach for the electrical and mechanical aspects of the chip, bringing the electronics and cooling design together and aiming to extract... » read more

Power/Performance Bits: Sept. 15


Higher-res lidar Researchers from Purdue University and École Polytechnique Fédérale de Lausanne (EPFL) devised a way to improve lidar and provide higher-resolution detection of nearby fast-moving objects through mechanical control and modulation of light on a silicon chip. "Frequency modulated continuous wave" (FMCW) lidar detects objects by scanning laser light from the top of a vehicl... » read more

Power/Performance Bits: Sept. 9


Smaller, cheaper integrated photonics Researchers from the University of California Santa Barbara, California Institute of Technology (Caltech), and Ecole Polytechnique Fédérale de Lausanne (EPFL) developed a way to integrate an optical frequency comb on a silicon photonic chip. Optical frequency combs are collections of equally spaced frequencies of laser light (so called because when pl... » read more

Manufacturing Bits: Feb. 26


Vitamin C chips Using vitamin C, Rice University has developed a process that turns gold nanorods into small gold nanowires. Nanorods are a type of structure, while nanowires are simply tiny wires. With the technology, Rice is able to produce nanowires with various lengths. These can be used in electronics as well as light-manipulating applications like plasmons. A “plasmon is a quantum o... » read more

Manufacturing Bits: Nov. 6


FISH metrology The University of Illinois at Urbana-Champaign and the Mayo Clinic have developed a new molecular probe for use in imaging cells in living organisms. The probe combines conventional fluorescence in situ hybridization (FISH) metrology techniques with compact quantum dots. This technology can measure and count ribonucleic acid (RNA) in cells and tissue without organic dyes. ... » read more

Manufacturing Bits: March 13


Gallium oxide substrates Kyma Technologies has rolled out a substrate line based on crystalline beta-phase gallium oxide (β-Ga2O3) materials. [caption id="attachment_24132458" align="alignleft" width="300"] Single crystal gallium oxide (ß-Ga2O3) substrates (Source: Kyma)[/caption] Crystalline beta gallium oxide is a promising wide bandgap semiconductor material. It has a large bandgap... » read more

Manufacturing Bits: Dec. 12


3D diodes At the recent IEEE International Electron Devices Meeting (IEDM) in San Francisco, the Ecole Polytechnique Fédérale de Lausanne (EPFL) and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) presented a paper on what they call the world’s first back-illuminated 3D-stacked, single-photon avalanche diode (SPAD) in 45nm CMOS technology. A SPAD is one type of a photodetector. These... » read more

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