tag: Ecole Polytechnique Federale de Lausanne

Research Bits: Dec. 8
By Jesse Allen - 08 Dec, 2025 - Comments: 0

Iron-on circuit Researchers from Virginia Tech developed iron-on electronic circuits that can be applied to clothing. The patch uses electrically conductive liquid metal and a heat-activated adhesive to bond to fabric when heated with a hot iron. “E-textiles and wearable electronics can enable diverse applications from health care and environmental monitoring to robotics and human-machine... » read more

Machine Learning Tools Accelerate Materials Discovery
By Katherine Derbyshire - 20 Nov, 2025 - Comments: 0

Literature searches, simulations, and practical experiments have been part of the materials science toolkit for decades, but the last few years have seen an explosion of machine learning-driven software tools that promise to accelerate all three. Many of the challenges facing the semiconductor manufacturing industry are fundamentally materials science problems. What metal has the lowest resi... » read more

Research Bits: Sept. 16
By Jesse Allen - 16 Sep, 2025 - Comments: 0

Beyond-EUV resists Researchers from Johns Hopkins University, East China University of Science and Technology, École Polytechnique Fédérale de Lausanne (EPFL), Soochow University, Brookhaven National Laboratory, and Lawrence Berkeley National Laboratory propose a combination of new resist materials and a higher-powered EUV process that could enable smaller chip feature sizes. The "beyond... » read more

Research Bits: August 26
By Jesse Allen - 26 Aug, 2025 - Comments: 0

THz-optical converter Researchers from École Polytechnique Fédérale de Lausanne (EPFL) and Harvard University designed a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device. Applications include communication, sensing, spectroscopy, and computing. The design embeds micron-sized transmission lines into a lithium niobate photonic chip... » read more

In-Depth Study of Low-Power MCUs For Wearables (EPFL)
By Technical Paper Link - 28 Dec, 2024 - Comments: 0

A new technical paper titled "Enabling Efficient Wearables: An Analysis of Low-Power Microcontrollers for Biomedical Applications" was published by researchers at EPFL. Abstract "Breakthroughs in ultra-low-power chip technology are transforming biomedical wearables, making it possible to monitor patients in real time with devices operating on mere {\mu}W. Although many studies have examined... » read more

Chip Industry Week In Review
By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Research Bits: July 16
By Jesse Allen - 16 Jul, 2024 - Comments: 0

Kirigami-inspired mechanical computer Researchers from North Carolina State University developed a kirigami-inspired mechanical computer that uses a complex structure of rigid, interconnected polymer cubes to store, retrieve, and erase data without relying on electronic components. The system uses 1-centimeter plastic cubes, grouped into functional units consisting of 64 interconnected cubes. ... » read more

2D UltraLow Temperatures, High Performance Quantum
By Technical Paper Link - 07 Jul, 2024 - Comments: 0

A new technical paper titled "Electrically tunable giant Nernst effect in two-dimensional van der Waals heterostructures" was published by researchers at EPFL and National Institute for Materials Science (Japan). Abstract "The Nernst effect, a transverse thermoelectric phenomenon, has attracted significant attention for its potential in energy conversion, thermoelectrics and spintronics. ... » read more

Voltage Reference Architectures For Harsh Environments: Quantum Computing And Space
By Technical Paper Link - 02 May, 2024 - Comments: 0

A technical paper titled “Cryo-CMOS Voltage References for the Ultrawide Temperature Range From 300 K Down to 4.2 K” was published by researchers at Delft University of Technology, QuTech, Kavli Institute of Nanoscience Delft, and École Polytechnique Fédérale de Lausanne (EPFL). Abstract: "This article presents a family of sub-1-V, fully-CMOS voltage references adopting MOS devices in ... » read more

Large-Scale Integration Of 2D Materials As The Semiconducting Channel In An In-Memory Processor (EPFL)
By Technical Paper Link - 03 Jan, 2024 - Comments: 0

A technical paper titled “A large-scale integrated vector-matrix multiplication processor based on monolayer molybdenum disulfide memories” was published by researchers at École Polytechnique Fédérale de Lausanne (EPFL). Abstract: "Data-driven algorithms—such as signal processing and artificial neural networks—are required to process and extract meaningful information from the mass... » read more

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