Preparing For 5G Millimeter Wave And 6G

By Ed Sperling - 21 Jun, 2023 - Comments: 0

Cellular technology is about to take a giant leap forward, but the packaging, assembly, and testing of the chips used in 5G millimeter wave and the forthcoming 6G ecosystem will be significantly more complicated than anything used in the past. So far, most 5G devices are still working at sub-6 GHz frequencies. A massive rollout of mmWave technology over the next few years will significantly ... » read more

Improving Image Resolution At The Edge

By Ed Sperling - 30 May, 2023 - Comments: 0

How much cameras see depends on how accurately the images are rendered and classified. The higher the resolution, the greater the accuracy. But higher resolution also requires significantly more computation, and it requires flexibility in the design to be able to adapt to new algorithms and network models. Jeremy Roberson, technical director and software architect for AI/ML at Flex Logix, talks... » read more

Edge HW-SW Co-Design Platform Integrating RISC-V And HW Accelerators

By Technical Paper Link - 16 May, 2023 - Comments: 0

A new technical paper titled "EigenEdge: Real-Time Software Execution at the Edge with RISC-V and Hardware Accelerators" was published by researchers at Columbia University. "We introduce a hardware/software co-design approach that combines software applications designed with Eigen, a powerful open-source C++ library that abstracts linear-algebra workloads, and real-time execution on heterog... » read more

EPFL’s Open Source Single-Core RISC-V Microcontroller for Edge Computing

By Technical Paper Link - 30 Apr, 2023 - Comments: 0

A new technical paper titled "X-HEEP: An Open-Source, Configurable and Extendible RISC-V Microcontroller" was published by researchers at Ecole Polytechnique Fédérale de Lausanne (EPFL). Abstract: "In this work, we present eXtendible Heterogeneous Energy-Efficient Platform (X-HEEP), a configurable and extendible single-core RISC-V-based ultra-low-power microcontroller. X-HEEP can be used ... » read more

100G Ethernet At The Edge

By Ed Sperling - 19 Apr, 2023 - Comments: 0

The amount of data is growing, and so is the need to process it closer to the source. The edge is a middle ground between the cloud and the end point, close enough to where data is generated to reduce the time it takes to process that data, yet still powerful enough to analyze that data quickly and send it wherever it is needed. But to make this all work requires faster conduits for that data i... » read more

Shift Register-In-Memory Architecture

By Technical Paper Link - 19 Mar, 2023 - Comments: 0

A new technical paper titled "Toward Single-Cell Multiple-Strategy Processing Shift Register Powered by Phase-Change Memory Materials" was published by researchers at Singapore University of Technology and Design and University of Cambridge. Abstract "Modern innovations are built on the foundation of computers. Compared to von Neumann architectures having separate storage and processing uni... » read more

Review of Tools & Techniques for DL Edge Inference

By Technical Paper Link - 16 Feb, 2023 - Comments: 0

A new technical paper titled "Efficient Acceleration of Deep Learning Inference on Resource-Constrained Edge Devices: A Review" was published in "Proceedings of the IEEE" by researchers at University of Missouri and Texas Tech University. Abstract: Successful integration of deep neural networks (DNNs) or deep learning (DL) has resulted in breakthroughs in many areas. However, deploying thes... » read more

Heterogeneous Multi-Core HW Architectures With Fine-Grained Scheduling of Layer-Fused DNNs

By Technical Paper Link - 29 Jan, 2023 - Comments: 0

A technical paper titled "Towards Heterogeneous Multi-core Accelerators Exploiting Fine-grained Scheduling of Layer-Fused Deep Neural Networks" was published by researchers at KU Leuven and TU Munich. Abstract "To keep up with the ever-growing performance demand of neural networks, specialized hardware (HW) accelerators are shifting towards multi-core and chiplet architectures. So far, thes... » read more

Choosing The Correct High-Bandwidth Memory

By Ann Mutschler - 25 Jan, 2023 - Comments: 0

The number of options for how to build high-performance chips is growing, but the choices for attached memory have barely budged. To achieve maximum performance in automotive, consumer, and hyperscale computing, the choices come down to one or more flavors of DRAM, and the biggest tradeoff is cost versus speed. DRAM remains an essential component in any of these architectures, despite years ... » read more

Choosing The Right Memory At The Edge

By Ed Sperling - 09 Jan, 2023 - Comments: 0

As the amount of data produced by sensors in cars and phones continues to grow, more of that data needs to be processed locally. It takes too much time and power to send it all to the cloud. But choosing the right memory for a particular application requires a series of tradeoffs involving cost, bandwidth, power, which can vary greatly by device, application, and even the data itself. Frank Fer... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?