What’s At Stake In System Design?

By Cadence - 03 Apr, 2024 - Comments: 0

When engineers refer to system analysis, they are referring to tool functions for improving an overall electronics design. What you will gain from this eBook: Power and Signal Integrity Insights into harmonic balancing and crosstalk analysis Learning about loop gain and transmission rates Examining the necessity of power-aware systems Electromagnetic Analysis Knowledge ... » read more

Holistic 3D-IC Interposer Analysis In Product Designs

By Ben Gu - 22 Sep, 2022 - Comments: 1

The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization and better interconnection. This vertical stacking of ICs enables the next generation of sophisticated, intelligent devices, necessitating high chip density and terabytes of bandwidth. As per the f... » read more

Radar Wave Propagation Through Materials

By Infineon - 11 Aug, 2021 - Comments: 0

This white paper focuses on electromagnetic (EM) wave propagation through materials. For radar systems, this is of interest when radar must pass through walls, or when designing radomes (cover casings for the radar system). In the process of designing a radome, you should always perform full EM simulation. However, the content of this white paper will help you to first estimate whether a radome... » read more

How To Build A Virtual Electromagnetic Test Environment For Aerospace And Automotive Platforms

By Ansys - 09 Jun, 2021 - Comments: 0

To protect the electromagnetic compatibility (EMC) of complex systems like aircraft and automobiles, you need a full electromagnetic (EM) model. A virtual test environment allows you to assess a design and ensure system-level compatibility before physical testing. This process has been proven to save more than $1 million compared to an approach based solely on testing. Learn how to build a v... » read more

Week In Review: Design, Low Power

By Jesse Allen - 05 Apr, 2019 - Comments: 0

Tools & IP Cadence entered the system design and analysis market with the release of Clarity 3D Solver, which creates S-parameter models for use in signal integrity, power integrity, and electromagnetic compliance analysis. The tool uses a distributed adaptive meshing approach for cloud and on-premises distributed computing and it optimized to distribute a job across multiple low-cost comp... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.