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Holistic 3D-IC Interposer Analysis In Product Designs


The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization and better interconnection. This vertical stacking of ICs enables the next generation of sophisticated, intelligent devices, necessitating high chip density and terabytes of bandwidth. As per the f... » read more

Radar Wave Propagation Through Materials


This white paper focuses on electromagnetic (EM) wave propagation through materials. For radar systems, this is of interest when radar must pass through walls, or when designing radomes (cover casings for the radar system). In the process of designing a radome, you should always perform full EM simulation. However, the content of this white paper will help you to first estimate whether a radome... » read more

How To Build A Virtual Electromagnetic Test Environment For Aerospace And Automotive Platforms


To protect the electromagnetic compatibility (EMC) of complex systems like aircraft and automobiles, you need a full electromagnetic (EM) model. A virtual test environment allows you to assess a design and ensure system-level compatibility before physical testing. This process has been proven to save more than $1 million compared to an approach based solely on testing. Learn how to build a v... » read more

Week In Review: Design, Low Power


Tools & IP Cadence entered the system design and analysis market with the release of Clarity 3D Solver, which creates S-parameter models for use in signal integrity, power integrity, and electromagnetic compliance analysis. The tool uses a distributed adaptive meshing approach for cloud and on-premises distributed computing and it optimized to distribute a job across multiple low-cost comp... » read more