Four Real-World Applications for Electromagnetic Simulation

By Keysight - 30 Oct, 2024 - Comments: 0

With the complexity of integrated circuit (IC) components increasing, electromagnetic (EM) circuit simulation is now critical for accurate and efficient design. The EM effects on a circuit can drastically alter voltage levels and damage semiconductor devices. With EM simulation, designers can account for EM effects on their circuit to avoid costly problems before they happen. EM simulation e... » read more

Running On Star Power

By Laura Carter - 11 Apr, 2024 - Comments: 0

What can generate four times more energy than a nuclear power plant and nearly four million times more energy than burning oil or coal? Fusion energy, according to the International Atomic Energy Agency. A fusion reaction happens as the result of a collision between two light atomic nuclei to form a heavier one. All of this occurs within plasma: a hot, charged gas of positive ions and free-mov... » read more

The Computational Electromagnetics Simulation Challenge Of 3D-IC

By Kelly Damalou - 29 Nov, 2022 - Comments: 0

By Kelly Damalou and Matt Commens Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging technologies have advanced the state of the art beyond SoC technologies which first united digital, analog, and memory functions on a single chip in the '90s. These ... » read more

A Look Inside RF Design

By Don Dingee - 01 Aug, 2022 - Comments: 1

RF EDA continues pushing the boundaries for today’s complex system designs. Connected workflows are creating shift left opportunities for engineering in virtual space. RF and microwave architects and designers can accelerate design and verification with powerful electromagnetic (EM) modeling and simulation technology. In the webinar for the 2023 launch of PathWave Advanced Design System (ADS)... » read more

Electromagnetic Simulation And 3D-IC Interposers

By Matt Commens - 11 Jul, 2022 - Comments: 0

By Matt Commens, Juliano Mologni, and Pete Gasperini Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory (DRAM) deployments that appeared on the market a decade ago, 3D-IC has since expanded its reach. It is now decisively beginning to achieve the... » read more

The Foundations Of Computational Electromagnetics

By Matt Commens - 30 Mar, 2022 - Comments: 0

Maxwell’s Equations can be expressed in multiple variants – there are integral and differential versions in both frequency and time domains, along with quasi-static and full-wave forms. Their elegance is evident upon sight yet for only the simplest systems are there known solutions. Thus, without assumptions to simplify the math and/or system under study, it is frequently impossible to full... » read more

The Physics Of Ports And Associated Ground For EM Simulators Serving RF Designs

By Cadence - 09 Dec, 2021 - Comments: 0

The use of ports in electromagnetic (EM) simulators has evolved and matured over the years to make real-world design simulations practical. Having a foundational understanding of ports provides an intuitive skill in their proper selection and use in conjunction with circuit simulation. In this white paper, we examine ports common to EM simulators, which are the most common simulators for microw... » read more

The Impact Of Multiphysics On Production Electronic Design

By Marc Swinnen - 09 Sep, 2021 - Comments: 0

For many electronic design professionals, it has become clear that the industry is transitioning through an inflection point that is shifting some of the ground rules of design. The increase in the speed and integration density in today’s systems are blurring the lines between chip design and traditional board or system design. This finds its fullest expression in multi-die, 3D integrated ... » read more

Innovations In High-Frequency Electromagnetic Simulation

By Rick Petersson - 07 May, 2021 - Comments: 0

High-frequency electromagnetic simulation has evolved from “wow, now I can see how electromagnetic fields behave” to needing to know how various EM fields interact in large, complex systems. During that time, I have been an R&D engineer and I have managed a team implementing various solver technologies. We’ve been presented with plenty of challenges as electronics have continued to pr... » read more

10X Faster Electromagnetic 3D Simulation

By Denis Soldo - 15 Dec, 2020 - Comments: 0

Virtual prototypes are essential to optimize the signal integrity performance of their high-performance electronics products. Today, engineering teams are pushing to get fast electromagnetic (EM) simulations of printed circuit boards (PCB) and 3D chip packages in just a few hours with the highest level of accuracy. The state of the art in EM simulation has come a long way: Back in 2000 it wa... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?