Development Tools Enabling The Internet of Things


I'm at the Embedded World conference in Nuremberg this week. Yes, between Mobile World Congress in Barcelona and DVCon in San Jose, Calif., I chose Embedded World. Unfettered by unseasonally late snow and bad weather, it turns out this was the right decision. I have not attended this show for a couple of years and am pleased to find that the show has developed quite a bit. There are more than 8... » read more

ST-Ericsson 28nm FD-SOI/ARM Chip Hits 2.8GHz at CES


Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ What a great start to 2013: at CES in Las Vegas, ST-Ericsson announced the NovaThor™ L8580 ModAp, “the world’s fastest and lowest-power integrated LTE smartphone platform.” This is the one that’s on STMicroelectronics’ 28nm FD-SOI, with sampling set for Q1 2013. And it’s a game changer – for users, fo... » read more

ST’s FD-SOI Tech Available to All Through GF


Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ In the spring of 2012, STMicroelectronics announced the company would be manufacturing ST-Ericsson’s next-generation (and very successful) NovaThor ARM-based smartphone/tablet processors using 28nm FD-SOI process technology. With first samples coming out this fall, ASN talks to Jean-Marc Chery, Executive Vice Pres... » read more

What’s ST’s FD-SOI Technology All About?


As I blogged here on SemiMD last week, STMicroelectronics has announced that to supplement in-house production at their fab in Crolles, the company has tapped GlobalFoundries for high-volume production of 28nm then 20nm FD-SOI mobile devices.  ST will also open access to its FD-SOI technology to GlobalFoundries’ other customers.  High-volume manufacturing will kick off with ST-Ericsson’s ... » read more

GloFo to Fab 28/20nm FD-SOI for ST; ST Tech Open to GF Customers


Two big pieces of news have recently been announced by STMicroelectronics: to supplement in-house production at Crolles, the company has tapped GlobalFoundries for high-volume production of 28nm then 20nm FD-SOI mobile devices; ST will open access to its FD-SOI technology to GlobalFoundries’ other customers. The high-volume manufacturing will kick off with ST-Ericsson’s ARM-based 2... » read more

ST-Ericsson 28nm FD-SOI smartphone SOC, Q3 tape-out (interview)


ASN recently had a chance to talk to ST-Ericsson’s Chief Chip Architect Louis Tannyeres  about the move to 28nm FD-SOI for smartphones and tablet SOCs.  Take-away message:  FD-SOI solves – with less process complexity – scaling, leakage and variability issues to further shrink CMOS technology beyond 28nm. Here's what he said. ~~ [caption id="attachment_441" align="alignleft" wi... » read more

ST-Ericsson NovaThor This Year, 28nm FDSOI, Soitec Wafers


Big and official FD-SOI news: Soitec has announced that the company is supplying the FD-SOI wafers for ST-Ericsson’s next-generation of NovaThor 8540 smartphone/tablet processors. Starting at the 28nm node, this marks the industry’s first industrialization of the new planar, fully-depleted technology on ultra-thin SOI wafers. Soitec has just issued an official press release, but ST-Eri... » read more

FD-SOI Workshop ppts – STM’s 1st 28nm FD-SOI product line


The SOI Consortium’s 6th FD-SOI workshop, held just after ISSCC, yielded some exciting news. Most of the presentations are freely available for downloading from the SOI Consortium website. Here are the highlights. STMicroelectronics In a terrific presentation by Giorgio Cesana, Marketing Director at STMicroelectronics, he revealed that the company would be releasing a major product line b... » read more

FD-SOI bests FinFETs for mobile multimedia SOCs? ST says yes.


In a recent and excellent article in ASN by Thomas Skotnicki, Director of the Advanced Devices Program at STMicro, he explains in a very clear and accessible way why FD-SOI with ultra-thin Body & Box (UTBB) is a better solution for mobile, multimedia SOCs than FinFETs -- starting at the 28nm node and running clearly through 8nm.  It is based on the paper he presented at the 2011 IEEE SOI C... » read more

Easing System Creation With Embedded Hardware Solutions And Standards


By Cheryl Ajluni System creation is today an ultra-complex task. On one hand, developers are confronted with consumer demands for ever more functionality, better performance and increased power efficiency at a lower cost. On the other hand, they face stringent time-to-market requirements and changing standards, coupled with the need to accommodate a range of requirements pertaining to differen... » read more

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