ST’s FD-SOI Tech Available to All Through GF

By Various Writers - 08 Oct, 2012 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ In the spring of 2012, STMicroelectronics announced the company would be manufacturing ST-Ericsson’s next-generation (and very successful) NovaThor ARM-based smartphone/tablet processors using 28nm FD-SOI process technology. With first samples coming out this fall, ASN talks to Jean-Marc Chery, Executive Vice Pres... » read more

What’s ST’s FD-SOI Technology All About?

By Various Writers - 22 Jun, 2012 - Comments: 0

As I blogged here on SemiMD last week, STMicroelectronics has announced that to supplement in-house production at their fab in Crolles, the company has tapped GlobalFoundries for high-volume production of 28nm then 20nm FD-SOI mobile devices. ST will also open access to its FD-SOI technology to GlobalFoundries’ other customers. High-volume manufacturing will kick off with ST-Ericsson’s ... » read more

GloFo to Fab 28/20nm FD-SOI for ST; ST Tech Open to GF Customers

By Various Writers - 15 Jun, 2012 - Comments: 0

Two big pieces of news have recently been announced by STMicroelectronics: to supplement in-house production at Crolles, the company has tapped GlobalFoundries for high-volume production of 28nm then 20nm FD-SOI mobile devices; ST will open access to its FD-SOI technology to GlobalFoundries’ other customers. The high-volume manufacturing will kick off with ST-Ericsson’s ARM-based 2... » read more

ST-Ericsson 28nm FD-SOI smartphone SOC, Q3 tape-out (interview)

By Various Writers - 24 Apr, 2012 - Comments: 0

ASN recently had a chance to talk to ST-Ericsson’s Chief Chip Architect Louis Tannyeres about the move to 28nm FD-SOI for smartphones and tablet SOCs. Take-away message: FD-SOI solves – with less process complexity – scaling, leakage and variability issues to further shrink CMOS technology beyond 28nm. Here's what he said. ~~ [caption id="attachment_441" align="alignleft" wi... » read more

ST-Ericsson NovaThor This Year, 28nm FDSOI, Soitec Wafers

By Various Writers - 14 Mar, 2012 - Comments: 0

Big and official FD-SOI news: Soitec has announced that the company is supplying the FD-SOI wafers for ST-Ericsson’s next-generation of NovaThor 8540 smartphone/tablet processors. Starting at the 28nm node, this marks the industry’s first industrialization of the new planar, fully-depleted technology on ultra-thin SOI wafers. Soitec has just issued an official press release, but ST-Eri... » read more

FD-SOI Workshop ppts – STM’s 1st 28nm FD-SOI product line

By Various Writers - 12 Mar, 2012 - Comments: 0

The SOI Consortium’s 6th FD-SOI workshop, held just after ISSCC, yielded some exciting news. Most of the presentations are freely available for downloading from the SOI Consortium website. Here are the highlights. STMicroelectronics In a terrific presentation by Giorgio Cesana, Marketing Director at STMicroelectronics, he revealed that the company would be releasing a major product line b... » read more

FD-SOI bests FinFETs for mobile multimedia SOCs? ST says yes.

By Various Writers - 29 Nov, 2011 - Comments: 0

In a recent and excellent article in ASN by Thomas Skotnicki, Director of the Advanced Devices Program at STMicro, he explains in a very clear and accessible way why FD-SOI with ultra-thin Body & Box (UTBB) is a better solution for mobile, multimedia SOCs than FinFETs -- starting at the 28nm node and running clearly through 8nm. It is based on the paper he presented at the 2011 IEEE SOI C... » read more

Easing System Creation With Embedded Hardware Solutions And Standards

By Cheryl Ajluni - 27 Mar, 2009 - Comments: 0

By Cheryl Ajluni System creation is today an ultra-complex task. On one hand, developers are confronted with consumer demands for ever more functionality, better performance and increased power efficiency at a lower cost. On the other hand, they face stringent time-to-market requirements and changing standards, coupled with the need to accommodate a range of requirements pertaining to differen... » read more

The Great Debate: Fewer Functions?

By Ed Sperling - 19 Feb, 2009 - Comments: 0

By Ed Sperling What do you do when you can’t fit any more functionality on a chip without blowing your power budget? That question is being debated inside IBM right now, and one of the more radical concepts is to actually have systems do fewer things. “That trend will happen,” said Brad McCredie, chief architect of the Power6 chip and an IBM Fellow. “I think devices w... » read more

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