tag: EMD Electronics

Chip Industry Week In Review
By The SE Staff - 01 Nov, 2024 - Comments: 0

Siemens announced plans to acquire Altair Engineering, a provider of industrial simulation and analysis, data science, and high-performance computing (HPC) software, for about $10 billion. Altair's software will become part of Siemens' Xcelerator portfolio and provide a boost to physics-based digital twins. Onto Innovation bought Lumina Instruments, a San Jose, California-based maker of lase... » read more

New Materials Are in High Demand
By Bryon Moyer - 19 Sep, 2024 - Comments: 0

Materials suppliers are responding to the intense pressures to improve power, performance, scaling, and cost issues, which follows a long timeline from synthesis to development and high volume manufacturing in fabs. The advances in machine learning help present a wide field of candidates, which engineers then narrow to potential use. When building standard logic semiconductor chips, the prim... » read more

Precise Control Needed For Copper Plating And CMP
By Anne Meixner - 20 Jun, 2024 - Comments: 0

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in order to extend the usefulness of copper interconnects. Copper is well understood and easy to work with, but it is running out of steam. At 5nm and below, copper plating tools are struggling to... » read more

Blog Review: March 8
By Jesse Allen - 08 Mar, 2023 - Comments: 0

Synopsys' Rahul Thukral and Bhavana Chaurasia find that embedded MRAM is undergoing an uplift in utilization for low-power, advanced-node SoCs thanks to its high capacity, high density, and ability to scale to lower geometries. Siemens EDA's Chris Spear dives into the UVM Factory with a look at the  SystemVerilog Object-Oriented Programming concepts behind the factory. Cadence's Veena Pa... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 11 Nov, 2022 - Comments: 0

U.S. President Joe Biden appears ready to increase pressure on Japan and the Netherlands to help block the flow of advanced chip technology to China, where it can be used to develop cutting-edge weapons. "You will see Japan and Netherlands follow our lead," U.S. Commerce Secretary Gina Raimondo told CNBC. Japan plans to budget ¥350 billion ($2.38 billion) in a research collaboration with th... » read more

Blog Review: Feb. 23
By Jesse Allen - 23 Feb, 2022 - Comments: 0

Synopsys' Varun Agrawal looks at four new technologies have emerged to support the demands on 5G networks and applications, the challenges in validating all of those technologies together, and what's needed to perform end-to-end testing effectively for 5G O-RAN SoCs. Siemens EDA's Ray Salemi points to how FPGA retargeting could help address supply chain difficulties and some of the challenge... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Dec, 2021 - Comments: 0

Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Blog Review: Sept. 22
By Jesse Allen - 22 Sep, 2021 - Comments: 0

Ansys' Tyler Ferris describes some of the many ways electronics on a PCB assembly can fail, from component level failures like wirebond breaking and liftoff to board-level failures such as conductive anodic filament failure. Cadence's Paul McLellan considers the switch from low-speed parallel interfaces to high-speed serial interfaces as one of the key advancements making modern data centers... » read more

Nudging 2D semiconductors forward
By Katherine Derbyshire - 16 Sep, 2021 - Comments: 1

The buzz about 2D materials replacing silicon appears to be premature. While 2D semiconductors have emerged as potential successors, it's not clear when or even if that will happen. As Iuliana Radu, Imec's director of quantum and exploratory computing observed, the “end” of silicon has been predicted many times before. It is not clear when 2D semiconductors will need to be ready. In fac... » read more

Designing 2.5D Systems
By Brian Bailey - 15 Mar, 2021 - Comments: 0

As more designs hit the reticle limit, or suffer from decreasing yield, migrating to 2.5D designs may provide a path forward. But this kind of advanced packaging also comes with some additional challenges. How you adapt and change your design team may be determined by where your focus has been in the past, or what you are trying to achieve. There are business, organizational, and technical c... » read more

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