Wednesday At DAC 2018

By Brian Bailey - 28 Jun, 2018 - Comments: 0

Wednesday starts with a visionary talk followed by a keynote. The Visionary talk was given by Chidi Chidambaram, VP of engineering for Qualcomm, and looked at 'Challenges to Enable 5G System Scaling.' "We have to start taking a system view rather than just following technology and at the same time we have to get concerned about durability," he said. "Mobile will continue to be the leader becaus... » read more

Formal Abstraction And Coverage

By Brian Bailey - 28 Jun, 2018 - Comments: 0

For the past three years, Oski Technology has facilitated a gathering of formal verification experts over dinner to discuss the problems and issues that they face. They discuss techniques they have been attempting with formal verification technologies, along with the results they have been achieving. Semiconductor Engineering was there to record that conversation and to condense it into the ... » read more

Emulation-Driven Implementation

By Ed Sperling - 22 Jun, 2018 - Comments: 0

Tech Talk: Haroon Chaudhri, director of Prime Power at Synopsys, talks about how to shorten time to market and increase confidence in advanced-node designs, while also reducing the amount of guard-banding and improving design freedom. https://youtu.be/xT3CIqjnaBk » read more

The Week In Review: Design

By Jesse Allen - 22 Jun, 2018 - Comments: 0

Tools Synopsys revealed a power analysis solution for early SoC design as well as signoff-accurate power and reliability closure. PrimePower has reliability as a major focus, expanding power and reliability signoff and ECO closure capabilities from physical awareness to cell electromigration effects. Supported power types include peak power, average power, clock network power, leakage power, a... » read more

The Veloce Strato Platform: Unique Core Components Create High-Value Advantages

By Mentor, a Siemens Business - 13 Jun, 2018 - Comments: 0

The Veloce Strato Emulation platform has sufficient execution speed, full visibility capabilities and ease-of-use in model creation and model updates to span the entire range of needs throughout the life of the design development process. To read more, click here. » read more

Get Ready For Verification 3.0

By Brian Bailey - 24 May, 2018 - Comments: 0

Jim Hogan, managing partner of Vista Ventures, LLC, is perhaps the best-known investor in the EDA space. Recently, he has been focusing time and attention on verification startups, including cloud technology company Metrics, and Portable Stimulus pioneer Breker Verification Systems. This adds to his longer-term commitment to formal verification with OneSpin Solutions. These companies are part ... » read more

EDA In The Cloud (Part 3)

By Brian Bailey - 23 May, 2018 - Comments: 1

Semiconductor Engineering sat down to discuss the migration of EDA tools into the Cloud with Arvind Vel, director of product management at ANSYS; Michal Siwinski, vice president of product management at Cadence; Richard Paw, product marketing manager at DellEMC, Gordon Allan, product manager at Mentor, a Siemens Business; Doug Letcher, president and CEO of Metrics, Tom Anderson, technical marke... » read more

EDA In The Cloud (Part 2)

By Brian Bailey - 02 May, 2018 - Comments: 0

Partitioning Becomes More Difficult

By Ann Mutschler - 30 Apr, 2018 - Comments: 0

The divide-and-conquer approach that has been the backbone of verification for decades is becoming more difficult at advanced nodes. There are more interactions from different blocks and features, more power domains, more physical effects to track, and far more complex design rules to follow. This helps explain why the number of tools required on each design—simulation, prototyping, em... » read more

Hidden Costs Of Shifting Left

By Brian Bailey - 26 Apr, 2018 - Comments: 0

The term "Shift Left" has been used increasingly within the semiconductor development flow to indicate tasks that were once performed sequentially must now be done concurrently. This is usually due to a tightening of dependences between tasks. One such example being talked about today is the need to perform hardware/software integration much earlier in the flow, rather than leaving it as a sequ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: emulation