Power/Performance Bits: Sept. 9


Smaller, cheaper integrated photonics Researchers from the University of California Santa Barbara, California Institute of Technology (Caltech), and Ecole Polytechnique Fédérale de Lausanne (EPFL) developed a way to integrate an optical frequency comb on a silicon photonic chip. Optical frequency combs are collections of equally spaced frequencies of laser light (so called because when pl... » read more

Week In Review: Design, Low Power


Galaxy Semiconductor re-established with the planned acquisition of the Quantix Business assets from Mentor, a Siemens business. The software products Galaxy is acquiring focus on yield optimization, device characterization, and reliability improvement. Galaxy was initially founded in 1998; the Galway, Ireland-based company was then acquired by Mentor Graphics in 2016. The re-established compan... » read more

Power/Performance Bits: May 5


CMOS-compatible laser Researchers at Forschungszentrum Jülich, Center for Nanoscience and Nanotechnology (C2N), STMicroelectronics, and CEA-Leti Grenoble developed a CMOS-compatible laser for optical data transfer. Comprised of germanium and tin, the efficiency is comparable with conventional GaAs semiconductor lasers on Si. Optical communications provide much higher data rates, and are be... » read more

Power/Performance Bits: Aug. 27


The sound of typing Cybersecurity researchers at the Southern Methodist University found a way to detect what a user is typing based on sensor data collected from a nearby smartphone. The team found that acoustic signals produced by typing on a computer keyboard can successfully be picked up by a smartphone, which can then be processed to determine which keys were struck – even in noisy conf... » read more

Blog Review: June 19


Mentor's Rebecca Lord digs into signal integrity complications and why today's high frequency signals make it important to understand the physics of transmission lines. Cadence's Meera Collier points to the need to recognize diversity and nuance when compiling AI training datasets and avoid the oversimplification that can lead to bias. Synopsys' Deepak Nagaria checks out the new features ... » read more

Manufacturing Bits: Feb. 26


Vitamin C chips Using vitamin C, Rice University has developed a process that turns gold nanorods into small gold nanowires. Nanorods are a type of structure, while nanowires are simply tiny wires. With the technology, Rice is able to produce nanowires with various lengths. These can be used in electronics as well as light-manipulating applications like plasmons. A “plasmon is a quantum o... » read more

Manufacturing Bits: Jan. 29


Thermal lithography Using a technique called thermal scanning probe lithography, New York University (NYU) and others have reported a breakthrough in fabricating 2D semiconductors. With the technology, researchers have devised metal electrodes with vanishing Schottky barriers on 2D semiconductors based on molybdenum disulfide (MoSâ‚‚). Thermal scanning probe lithography, sometimes called t-... » read more

Manufacturing Bits: Dec. 11


FinFET vs. FD-SOI pH sensors At the recent 2018 IEEE International Electron Devices Meeting (IEDM), TSMC and National Tsing Hua University presented a paper on an ion detector or pH sensor based on a 16nm finFET technology. Researchers have developed an advanced version of an ion-sensitive field-effect transistor (ISFET). Originally developed in the 1970s, ISFETs are pH sensors that are use... » read more

Manufacturing Bits: Nov. 6


FISH metrology The University of Illinois at Urbana-Champaign and the Mayo Clinic have developed a new molecular probe for use in imaging cells in living organisms. The probe combines conventional fluorescence in situ hybridization (FISH) metrology techniques with compact quantum dots. This technology can measure and count ribonucleic acid (RNA) in cells and tissue without organic dyes. ... » read more

Can Graphene Be Mass Manufactured?


Since the isolation of graphene in 2004, the high mobility and unique transport properties of 2-dimensional semiconductors have tantalized physicists and materials scientists. Their in-plane carrier transport and lack of dangling bonds potentially can minimize line/edge scattering and other effects of extreme scaling. While 2-D materials cannot compete with silicon at current device dime... » read more

← Older posts Newer posts →