3D Stacking: Reality Check


Semiconductor Manufacturing & Design examines the myth and reality of 3D stacking--and the hurdles that still need to be solved. In the hot seat: VC Jim Hogan; eSilicon's Prasad Subramanian; Sonics' Drew Wingard; Atrenta's Mike Gianfagna, and Mentor Graphics' Michael White. [youtube vid=fWQUGgwC-F4] » read more

Concurrent Design


The idea of developing software and hardware simultaneously isn't new, but it has taken on renewed urgency in IC design because of growing complexity, including power and proximity issues. Low-Power Engineering captures the perspective of executives at four companies working in this market: Marco Brambilla of STMicroelectronics; Charlie Janac of Arteris; Mike Gianfagna of Atrenta, and Javier De... » read more

Experts At The Table: Concurrent Design


Low-Power Engineering sat down with Marco Brambilla, ASIC design manager at STMicroelectronics; Charlie Janac, president and CEO of Arteris; Mike Gianfagna, vice president of marketing at Atrenta, and Javier DeLaCruz, director of semiconductor packaging at eSilicon. What follows are excerpts of that discussion. LPE: What is concurrent design and how has the definition changed? DeLaCruz: Th... » read more

Connecting System-Level Flows To Implementation Tools


By Ann Steffora Mutschler With the complexity explosion occurring in SoC design today, there is a relentless force to push design decisions further up in terms of abstraction. Resolving issues at the gate level is not possible any more because there just isn’t enough time or resources. Further, the resulting design may not even be competitive because optimization at the gate level can leave ... » read more

Tailoring IP, Tools And Flows


By Ann Steffora Mutschler As SoC and system complexity rises continually and software drives much more in a system, specific vertical application areas will require tailored IP and tool flows to allow designers to meet time-to-market demands. Today, many systems are designed around a platform, which contains most of the STAR IP—processors, GPUs, memory controllers, interconnects, memory s... » read more

Connecting System-Level Flows To Implementation Tools


By Ann Steffora Mutschler With the complexity explosion occurring in SoC design today, there is a relentless force to push design decisions further up in terms of abstraction. Resolving issues at the gate level is not possible any more because there just isn’t enough time or resources. Further, the resulting design may not even be competitive because optimization at the gate level can leave ... » read more

Tailoring IP, Tools And Flows


By Ann Steffora Mutschler As SoC and system complexity rises continually and software drives much more in a system, specific vertical application areas will require tailored IP and tool flows to allow designers to meet time-to-market demands. Today, many systems are designed around a platform, which contains most of the STAR IP—processors, GPUs, memory controllers, interconnects, memory s... » read more

A Refreshing Opportunity


By Jack Harding Fifteen years after its debut as a silicon strategy the SoC is finally in full bloom worldwide. In its simplest configuration it consists of a processor, memory, I/O and the RTL crafted by the customer that defines its functionality and application. For each of the four major elements we have evolved down a different strategic path. For the processor, ARM, MIPS and a couple ... » read more

Experts At The Table: IP Integration Hurdles


By Ed Sperling Low-Power Engineering sat down to discuss IP integration issues with Ken Brock, senior staff product marketing manager for logic libraries in Synopsys’ Solutions Group; Kalar Rajendiran, senior director of marketing at eSilicon; Mike Gianfagna, vice president of marketing at Atrenta; and Jim McCanny, CEO of Altos Design Automation. What follows are excerpts of that conversati... » read more

System-Level Technology Conversations Shift To Deployment


While much has been achieved to define a system-level design flow, more is still needed. Technology goals vary depending on the perspective of tool providers in terms of what needs to be done to realize the promise of a streamlined tool flow from TLM 2.0 down to GDS II. To many, 2011 will be an interesting year in the system-level design space as conversations with customers have shifted. �... » read more

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