Packaging Biz Faces Challenges in 2019


The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

MIS Packaging Takes Off


Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on MIS substrate technology, which is ramping up in the analog, power IC and even the cryptocurrency markets. MIS starts with a specialized substrate material for select IC packages. The MIS sub... » read more

Get Ready For Integrated Silicon Photonics


Long-haul communications and data centers are huge buyers of photonics components, and that is leading to rapid advances in the technology and opening new markets and opportunities. The industry has to adapt to meet the demands being placed on it and solve the bottlenecks in the design, development and fabrication of integrated silicon photonics. "Look at the networking bandwidth used across... » read more

Embedded Die Packaging Emerges


Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

Advanced Packaging Still Not So Simple


The promise of advanced packaging comes in multiple areas, but no single packaging approach addresses all of them. This is why there is still no clear winner in the packaging world. There are clear performance benefits, because the distance between two chips in a package can be significantly shorter than the distance that signals have to travel from one side of a die to another. Moreover, wi... » read more

Fan-Outs vs. TSVs


Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

Shortages Hit Packaging Biz


Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

What’s Missing In Packaging


The growth of advanced packaging on the leading edge of design is inching backwards into older nodes. With most technology—tools, methodologies, materials and processes—this is business as usual. But in packaging, it's both counterintuitive and potentially problematic. The main reason that companies began investing in advanced packaging—OSATs, foundries, chipmakers such as Intel and Qu... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Advanced Packaging For Automotive Dashboard Application


The current automotive market for the IC (integrated circuit) packaging industry has grown significantly due to the increasing need for automation and higher performance in vehicles. These changes in the automotive market will enable cars to be more reliable and intelligent. To address the increasingly complex demands of the automotive market, the semiconductor packaging industry is shifting it... » read more

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