Plugging Gaps In Advanced Packaging


The growing difficulty of cramming more features into an SoC is driving the entire chip industry to consider new packaging options, whether that is a more complex, integrated SoC or some type of advanced packaging that includes multiple chips. Most of the work done in this area so far has been highly customized. But as advanced packaging heads into the mainstream, gaps are beginning to appea... » read more

Going Open Source


Open Source often is thought of as an alternative to commercial software licensed using fairly typical business models. For example, variants of open source Linux supplied by companies such as Red Hat charge a subscription for support and maintenance. Maybe there is an opportunity to leverage Open Source alongside commercial EDA software to provide use model advantages and open development f... » read more