Dynamic Fault Injection Into Digital Twins Of Safety-Critical Systems


In this work we present a technology for dynamically introducing fault structures into digital twins without the need to change the virtual prototype model. The injection is done at the beginning of a simulation by dynamically rewiring the involved netlists. During the simulation on a real-time platform, faults can be activated or deactivated triggered by sequences, statistical effects or by ev... » read more

Virtual Prototyping In SoC Development


Modern semiconductor technologies enable manufacturers to pack more and more functions and memory into a single silicon die. While steadily advancing microintegration based on Moore’s Law just a few years ago mainly focused on increasing the clock frequency of integrated circuits (IC), today, it’s the design complexity and number of blocks that enable new IC functions. More and more logic b... » read more

Shifting Toward Data-Driven Chip Architectures


An explosion in data is forcing chipmakers to rethink where to process data, which are the best types of processors and memories for different types of data, and how to structure, partition and prioritize the movement of raw and processed data. New chips from systems companies such as Google, Facebook, Alibaba, and IBM all incorporate this approach. So do those developed by vendors like Appl... » read more

Targeting Redundancy In ICs


Technology developed for one purpose is often applicable to other areas, but organizational silos can get in the way of capitalizing on it until there is a clear cost advantage. Consider memory. All memories are fabricated with spare rows and columns that are swapped in when a device fails manufacturing test. "This is a common method to increase the yield of a device, based on how much memor... » read more

Failure Mechanism Detection Algorithm With MOSFET Body Diode


Autonomous driving is playing a big role in the automotive industry and defines the future of mobility on a big scale. However, autonomous driving faces several challenges, such as the performance of artificial intelligence and hardware reliability. To ensure safe functionality, the reliability of the electronic components plays an essential role and must be taken into consideration. One aspect... » read more

Do We Have An IC Model Crisis?


Models are critical for IC design. Without them, it's impossible to perform analysis, which in turn limits optimizations. Those optimizations are especially important as semiconductors become more heterogenous, more customized, and as they are integrated into larger systems, creating a need for higher-accuracy models that require massive compute power to develop. But those factors, and other... » read more

Chiplets: A Solution For The Shortage Of Chips


These days, there are new reports on the shortage of chips almost every day. Currently, this issue is affecting mainly car manufacturers such as Audi, Ford, and more. But other system manufacturers, such as in the machine construction industry, are also facing this challenge. Even manufacturers of mass-produced articles such as game consoles are reporting the same problems. The problem is sure ... » read more

11 Ways To Reduce AI Energy Consumption


As the machine-learning industry evolves, the focus has expanded from merely solving the problem to solving the problem better. “Better” often has meant accuracy or speed, but as data-center energy budgets explode and machine learning moves to the edge, energy consumption has taken its place alongside accuracy and speed as a critical issue. There are a number of approaches to neural netw... » read more

AnastASICA — Towards Structured and Automated Analog/Mixed-Signal IC Design For Automotive Electronics


In our world based on electronics, the design of analog/mixed-signal (AMS) ICs is still mainly done manually. While digital design benefits from complete synthesis flows, analog lags far behind in terms of development time, cost, and risk. Analog design flows are hardly standardized and necessitate the four eye principle as important quality tool. Thus, highly experienced designers who incorpor... » read more

Steep Spike For Chip Complexity And Unknowns


Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

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