tag: Fraunhofer IIS

Car Industry Changing Under The Hood
By Ann Mutschler - 07 Jan, 2021 - Comments: 0

After an initial burst of autonomous activity, the automotive ecosystem regrouped, re-evaluated its goals, and is now ready to begin deploying new technologies made possible by modern development approaches and forward-looking vehicle architectures. The pandemic hurt vehicle sales in 2020, but it also gave the OEMs a chance to catch their breath. Panic over announcements from other carmakers... » read more

Top Tech Videos Of 2020
By Linda Christensen - 30 Dec, 2020 - Comments: 0

2020 shaped up to be a year of major upheaval, emerging markets and even increased demand in certain sectors. So it's not surprising that videos focusing on AI, balancing power and performance, designing and manufacturing at advanced nodes, advanced packaging, and automotive-related subjects were the most popular. Of the 68 videos published this year, the following were the most viewed in ea... » read more

Artificial Intelligence For Sustainable And Energy Efficient Buildings
By Fraunhofer IIS/EAS - 11 Nov, 2020 - Comments: 0

According to the goals of Europe’s green deal missions, the continent strives for becoming carbon neutral by 2050. Since buildings are a major contributor to the overall consumption of energy, improving their energy efficiency can be a key to a more sustainable and greener Europe. On the way towards zero-emission buildings, several challenges have to be met: In modern energy systems, several ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 06 Nov, 2020 - Comments: 0

Tools Mentor unveiled Tessent Streaming Scan Network software for its Tessent TestKompress software. The new solution includes embedded infrastructure and automation that decouples core-level DFT requirements from the chip-level test delivery resources for a simplified bottom-up DFT flow. The bus-based scan data distribution architecture enables simultaneous testing of any number of cores and ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 06 Nov, 2020 - Comments: 0

Automotive Bosch licensed Arteris IP’s FlexNoC interconnect products for Bosch’s automotive chips. “Arteris IP provides the easiest and fastest means to assemble the complex chips we require while allowing us to implement innovative functional safety mechanisms within our designs,” said Oliver Wolst, senior vice president integrated circuits at Bosch. Mentor, a Siemens business, int... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 23 Oct, 2020 - Comments: 0

Automotive, automation General Motors is planning a third electric-vehicle plant. The former Saturn factory will make first fully electric Cadillac, in the former Saturn assembly line. Tesla is allowing some customers to beta test its Full Self-Driving (FSD), according to The Verge. The company pushed the software update to some early access customers to do some real world beta test. Some o... » read more

The Evolution Of High-Level Synthesis
By Brian Bailey - 27 Aug, 2020 - Comments: 3

High-level synthesis is getting yet another chance to shine, this time from new markets and new technology nodes. But it's still unclear how fully this technology will be used. Despite gains, it remains unlikely to replace the incumbent RTL design methodology for most of the chip, as originally expected. Seen as the foundational technology for the next generation of EDA companies around the ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 31 Jul, 2020 - Comments: 0

Analog Devices (ADI) acquired the HDMI business of Invecas. “The acquisition of Invecas' HDMI business positions ADI to deliver more complete solutions throughout the entire customer journey – from chip, to certification, to end product," said John Hassett, Senior Vice President, Industrial and Consumer at Analog Devices. "We are thrilled to enhance ADI’s capabilities with the addition of... » read more

Gaps Emerging In System Integration
By Brian Bailey - 29 Jun, 2020 - Comments: 0

The system integration challenge is evolving, but existing tools and methods are not keeping up with the task. New tools and flows are needed to handle global concepts, such as power and thermal, that cannot be dealt with at the block level. As we potentially move into a new era where IP gets delivered as physical pieces of silicon, this lack of an accepted flow will become a stumbling block. ... » read more

Interconnect Challenges Grow, Tools Lag
By Brian Bailey - 15 Jun, 2020 - Comments: 2

Interconnects are becoming much more problematic as devices shrink and the amount of data being moved around a system continues to rise. This limitation has shown up several times in the past, and it's happening again today. But when the interconnect becomes an issue, it cannot be solved in the same way issues are solved for other aspects of a chip. Typically it results in disruption in how ... » read more

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