tag: Fraunhofer

5nm Design Progress
By Ann Mutschler - 17 Jul, 2018 - Comments: 1

Activity surrounding the 5nm manufacturing process node is quickly ramping, creating a better picture of the myriad and increasingly complex design issues that must be overcome. Progress at each new node after 28nm has required an increasingly tight partnership between the foundries, which are developing new processes and rule decks, along with EDA and IP vendors, which are adding tools, met... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Manufacturing Bits: July 3
By Mark LaPedus - 03 Jul, 2018 - Comments: 0

X-ray holography Using a technique called X-ray holography, a group of researchers have uncovered the phase transitions of vanadium dioxide. X-ray holography is a promising high-resolution metrology technique. Vanadium dioxide is one of many materials that can exhibit metal or insulator properties depending on the temperature. Vanadium dioxide can switch from an insulating to a metallic pha... » read more

Toward Autonomous Farming
By Ann Mutschler - 03 May, 2018 - Comments: 0

While the automotive industry works diligently towards self-driving vehicles, it's possible the carrots you've eaten recently were semi-autonomously planted and harvested with Case IH equipment by Bolthouse Farms, one of the largest carrot growers in the United States. And the U.S. is hardly alone. Autonomous agriculture is coming everywhere, and it's happening much faster than autonomous ca... » read more

The Analog Design Gap
By Benjamin Prautsch - 08 Mar, 2018 - Comments: 0

By Benjamin Prautsch and Torsten Reich Sensors are everywhere. In the context of Industry 4.0 and IoT, we face an ever-increasing demand for high-quality sensing. Data acquisition is fundamental to adaptive production chains. So aggregating data isn't just some nice-to-have feature. It is the basis of modern production systems. But don’t we have sensors already? Isn’t everything fine?... » read more

Why All Nodes Won’t Work
By Ed Sperling - 08 Mar, 2018 - Comments: 4

A flood of new nodes, half-nodes and every number in between is creating confusion among chipmakers. While most say it's good to have choices, it's not clear which or how many of those choices are actually good. At issue is which [getkc id="43" kc_name="IP"] will be available for those nodes, how that IP will differ from other nodes in terms of power, performance, area and sensitivity to a v... » read more

A New Memory Contender?
By Mark LaPedus - 02 Jan, 2018 - Comments: 1

Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

The Trouble With Models
By Ed Sperling - 20 Dec, 2017 - Comments: 0

Models are becoming more difficult to develop, integrate and utilize effectively at 10/7nm and beyond as design complexity, process variation and physical effects add to the number of variables that need to be taken into account. Modeling is a way of abstracting the complexity in various parts of the semiconductor design, and there can be dozens of models required for complex SoCs. Some are ... » read more

Manufacturing Bits: Oct. 31
By Mark LaPedus - 31 Oct, 2017 - Comments: 0

Tiny jet engines The Max Planck Institute for Intelligent Systems has developed the world´s smallest jet engine. Samuel Sánchez, a researcher from the Stuttgart, Germany-based R&D organization, officially received the Guinness World Record certification for the smallest nanotube travelling through fluid. The technology makes use of propulsion, which resembles the characteristics of a ... » read more

Manufacturing Bits: Sept. 12
By Mark LaPedus - 12 Sep, 2017 - Comments: 0

Failure analysis for 2.5D/3D chips Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for light-induced capacitance alteration. It addresses the reliability issues for 2.5D/3D devices in a non-destructive and cost-effective manner at the wafer level. For s... » read more

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