Advanced Packaging Makes Testing More Complex


The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Week in Review: IoT, Security and Automotive


Internet of Things Western Digital Corp. and Codasip are working together on Western Digital’s SweRV Core EH1, which is a RISC-V core with a 32-bit, dual superscalar, 9-stage pipeline architecture. The core, launched earlier this is aimed at embedded devices supporting data-intensive edge applications, such as storage controllers, industrial IoT, real-time analytics in surveillance systems, ... » read more

Week In Review: Design, Low Power


Intel disclosed a speculative execution side-channel attack method called L1 Terminal Fault (L1TF). Leslie Culbertson, Intel's executive vice president and general manager of Product Assurance and Security, writes: "This method affects select microprocessor products supporting Intel Software Guard Extensions (Intel SGX) and was first reported to us by researchers at KU Leuven University, Techni... » read more

The Week In Review: Design/IoT


Mergers & Acqusitions Mentor Graphics acquired Tanner EDA, bolstering their position in tools for analog, mixed-signal and MEMs. Terms of the deal were not disclosed. NXP joins forces with Freescale. The merger carries a $16.7 billion price tag and potentially creates a new leader in the automotive and MCU markets. Standards Accellera sent UVM 1.2 off to the IEEE P1800.2 working... » read more