tag: GlobalFoundries

Building Up In 3D
By Ed Sperling - 18 Nov, 2010 - Comments: 0

By Ed Sperling Stacked die are expected to begin showing up in volume in late 2012 and in 2013, turning what has been a science experiment into a mainstream way of designing and manufacturing SoCs. This magnitude of this shift cannot be overstated, and clearly all of the pieces are not in place to make it all happen immediately. There also are significant technology challenges to overcome, ... » read more

The Future Of 3D Stacking
By Ed Sperling - 21 Oct, 2010 - Comments: 0

By Ed Sperling Despite concerns about the lack of tools, an unstable process, questionable interconnects, thermal overloads and electrostatic discharge, 3D stacking appears to be making headway. At the very least, lots of companies of all sizes are betting heavily that it will succeed. The first wave, which is expected to start showing up late next year, will likely come from a handful of t... » read more

What’s In The Package?
By Ed Sperling - 09 Sep, 2010 - Comments: 0

By Ann Steffora Mutschler The growing market for smart mobile devices and high-performance processors requiring more than 2GHz of processing power is driving IP providers to do even more work to prepare their IP offerings for customers. This theme was reflected at last week’s GlobalFoundries Global Technology Conference when the company’s senior VP of technology and R&D Gregg Bartle... » read more

The Shape Of Things To Come
By Ed Sperling - 26 Aug, 2010 - Comments: 0

By David Lammers Tall or thin? That is the question facing semiconductor companies, now reaching an “intense” phase in development of the vertical finFET and planar ETSOI (extra thin silicon on insulator) transistors for the 22/20nm and 15/14nm technology generations. “This is a conservative industry,” said Raj Jammy, vice president of materials and emerging technologies at Sematech... » read more

Betting On 3D
By Ed Sperling - 26 Aug, 2010 - Comments: 0

The continuation of Moore’s Law appears less in doubt than ever. Companies such as Intel, ST, AMD (via GlobalFoundries) and IBM are testing FinFETS and ETSOI and work is being done on the back end to ensure that these new structures can be manufactured with sufficient yield. What’s changed, though, is the resistance by other companies to the progression of Moore’s Law. There is no long... » read more

The Growing Problem With Parasitic Extraction
By Ed Sperling - 11 Feb, 2010 - Comments: 0

By Ed Sperling Like everything else in semiconductor engineering at advanced process geometries, parasitic extraction is getting much more difficult at each node. There’s more circuit data to analyze, less distance between wires and much more to sort through. In addition, a 10% error in accuracy at 90nm might have been tolerable, while at 28nm it can completely change how a chip works. ... » read more

Outsourcing’s New Face
By Ed Sperling - 29 Oct, 2009 - Comments: 0

By Ed Sperling As the semiconductor industry digs out from one of the worst downturns in decades, the business of semiconductor design and engineering is changing. While the architecture and features are still being developed by chip companies, the actual work of developing the chip increasingly is being done by third parties. Outsourcing is hardly new concept in business. In the early pa... » read more

Why The Chartered Semiconductor Acquisition Matters
By Ed Sperling - 11 Sep, 2009 - Comments: 0

The acquisition of Chartered by a wholly owned subsidiary of the Abu Dhabi government may sound like a rather brash investment, but our sources say it’s all part of a rather audacious plan that began unfolding one day after the deal to jointly run AMD’s foundry was hatched. In fact, this is anything but an impulsive buy by a country swimming in oil profits. The plan is actually to inte... » read more

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