tag: GlobalFoundries

The Hidden Costs Of Directed Self-Assembly
By Ed Sperling - 29 May, 2012 - Comments: 2

By Mark LaPedus Directed self-assembly (DSA) has been billed by some as a potential paradigm shift in semiconductor manufacturing, but it may not turn out to be quite the panacea its proponents suggest—or at least not yet. There are many questions surrounding DSA, an alternative lithography technology that makes use of block copolymers to enable fine pitches. Key among those questions ar... » read more

The 28nm Foundry Crunch
By Ed Sperling - 29 May, 2012 - Comments: 0

By Mark LaPedus Faced with huge and unforeseen demand at the 28nm node, leading-edge foundries are scrambling to play catch-up and are boosting their fab capacities at a staggering pace. But analysts warn that 28nm foundry capacity will be tight throughout 2012, and perhaps into 2013, putting some chipmakers in a pinch. Many blame the 28nm foundry capacity shortfall on a combination of t... » read more

28nm Super Low Power CMOS
By Various Writers - 29 May, 2012 - Comments: 0

28nm Super Low Power (28nm-SLP) is the low-power CMOS offering delivered on bulk silicon substrate for mobile consumer and digital consumer applications. GlobalFoundries' 28nm-SLP process technology is designed for the next generation of smart mobile devices, enabling designs with faster GHz processing speeds, higher circuit density, lower standby power and longer battery life. The 28nm process... » read more

New Power Standards Ahead
By Ed Sperling - 10 May, 2012 - Comments: 0

By Ed Sperling Standards groups are beginning to look at power and other physical effects much more seriously in the wake of the dueling power formats—UPF and CPF—that have caused angst across the design industry. To put it in perspective, when CPF and UPF were first introduced power was something of an afterthought in design. At 65nm it ceased to be something that could be dealt with l... » read more

Boosting Yield With Layout Awareness
By Ed Sperling - 26 Apr, 2012 - Comments: 0

By Ann Steffora Mutschler Yield. Just the word can make many engineers cringe and hide in their cubicles—especially with manufacturing problems and excessive power during test increasing causing failures. But the combination of physical data with diagnostics engines may be the light at the end of the tunnel, allowing for easier pinpointing of defects. There are many reasons why a chip fai... » read more

New Processes Define New Power Plans
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Pallab Chatterjee FinFETs, stacked die, heterogeneous interposers, TSVs, 450mm wafers, new interconnects and everything with MEMs and sensors is what the last few weeks have brought. A number of major announcements, technology releases, conference updates have identified these technologies as the future of IC design. At ISQED, Robert Geer, chief academic officer at the College of Nanosca... » read more

FinFET Vs. Tri-Gate
By Barry Pangrle - 05 Apr, 2012 - Comments: 0

By Barry Pangrle A large portion of the Common Platform Technology Forum, recently held in Santa Clara, was dedicated to presentations about 14nm process technologies and FinFETS. If you missed the event and are interested, many of the presentations are available from a link off of the Common Platform home page. Dick James wrote a nice article about GlobalFoundries’ claim that its FinFETS ar... » read more

Intel Turns Up Heat in Silicon Foundry Business
By Ed Sperling - 04 Apr, 2012 - Comments: 0

By Mark LaPedus Intel Corp. continues to make waves in the foundry arena. The chip giant has recently announced three new and major customers within its embryonic foundry business. Some speculate there are more customers on the horizon, reportedly including a rumored on-and-off again foundry deal with Apple Inc. At this point, Intel is a niche player in the foundry business, as the compan... » read more

Consortium Results (Part 3 of 3): 20nm FDSOI Comes Out Way Ahead
By Various Writers - 27 Mar, 2012 - Comments: 0

The results of the most recent SOI Consortium benchmarking study detail the interest of planar FD-SOI as early as the 28nm and 20nm technology nodes, in terms of performance, power and manufacturability. This 3-part blog series looks further at some of the implications. ~~ The SOI Industry Consortium announcement at the end of the year provided silicon proof that FD-SOI handily bea... » read more

New Winners And Losers
By Ed Sperling - 22 Mar, 2012 - Comments: 0

The realignment of the semiconductor industry has begun, most of it beneath the radar screen. In a disaggregated supply chain, any piece in isolation looks insignificant. But taken together, these shifts begin to paint a picture of a broad realignment and refocusing of the entire industry that ultimately will cement the fortunes of some and create new winners and losers out of others. The fi... » read more

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