The Week In Review: Manufacturing


Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

Blog Review: Oct. 25


Mentor's Joe Hupcey III explains the benefits of prioritizing faults with formal analysis before launching detailed fault verification. Cadence's Paul McLellan listens in as AMD's Mark Papermaster discusses what's needed to keep driving Moore's Law. Synopsys' Jesse Victors takes a look at ROCA, the latest flaw affecting RSA cryptography, and argues it may be time for a new encryption sche... » read more

Manufacturing Bits: Oct. 24


Redefining unit measurements At a recent meeting, the International Committee for Weights and Measures (CIPM) took the next step towards the expected redefinition of four base units within the International System of Units (SI). The SI base units include the following metrics or constants--meter, kilogram, second, ampere, kelvin, mole, and the candela. Here’s the fundamental constant... » read more

Radar Versus LiDAR


Demand is picking up for vision, radar and LiDAR sensors that enable assisted and autonomous driving capabilities in cars, but carmakers are now pushing for some new and demanding requirements from suppliers. The automotive market always has been tough on suppliers. OEMs want smaller, faster and cheaper devices at the same or improved safety levels for both advanced driver-assistance systems... » read more

The Week In Review: Manufacturing


Market research The IC market remains hot, as several market researchers are raising their forecasts--again. Gartner recently raised its overall IC forecast. Now, IC Insights has raised its IC market growth rate forecast for 2017 to 22%, up six percentage points from the 16% increase shown in its mid-year update. In March, IC Insights raised its worldwide IC market growth forecast for 2017 ... » read more

Improving Optical Overlay And Measurement


By Adam Ge and Shimon Levi Patterning challenges for the semiconductor industry are growing as the number of multi-patterned layers being used in the 10nm and beyond nodes increase. Patterning requires highly accurate overlay which has always been an issue, but with the added complexities of multi-patterning, smaller dimensions and subsequent tightening overlay error budget, it is now a majo... » read more

Next-Gen Mask Writer Race Begins


Competition is heating up in the mask writer equipment business as two vendors—Intel/IMS and NuFlare—vie for position in the new and emerging multi-beam tool segment. Last year, Intel surprised the industry by acquiring IMS Nanofabrication, a multi-beam e-beam mask writer equipment vendor. Also last year, IMS, now part of Intel, began shipping the world’s first multi-beam mask writer f... » read more

Blog Review: Oct. 18


Mentor's Nitin Bhagwath suggests some ways to deal with undesirable signal integrity effects in DDR designs. Cadence's Ken Willis argues that for multi-gigabit serial link interfaces, signal integrity analysis should start upstream of the traditional post-layout verification step. Synopsys' Ravindra Aneja contends that understanding formal core data can reduce the overall effort and short... » read more

The Week In Review: Manufacturing


Materials and equipment A scandal has rocked Japan’s Kobe Steel. The company disclosed that it has falsified inspection data for iron powder, aluminum and copper products that were sent to over 200 customers in the automotive, electronics, transportation and other sectors. The falsified data involves 20,000 tones of products, according to reports. Kobe apologized for the issues and provided ... » read more

The Week In Review: Design


Storage Western Digital uncorked disk drives based upon microwave-assisted magnetic recording technology. MAMR technology is one of two energy-assisted technologies the company has under development, the other being heat-assisted magnetic recording. Of the two, Western Digital said only MAMR has achieved the reliability required in data centers. The company noted that densities of its MAMR dev... » read more

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