Complex Tradeoffs In Inferencing Chips


Designing AI/ML inferencing chips is emerging as a huge challenge due to the variety of applications and the highly specific power and performance needs for each of them. Put simply, one size does not fit all, and not all applications can afford a custom design. For example, in retail store tracking, it's acceptable to have a 5% or 10% margin of error for customers passing by a certain aisle... » read more

New Uses For AI In Chips


Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

What Future Processors Will Look Like


Mark Papermaster, CTO at AMD, sat down with Semiconductor Engineering to talk about architectural changes that are required as the benefits of scaling decrease, including chiplets, new standards for heterogeneous integration, and different types of memory. What follows are excerpts of that conversation. SE: What does a processor look like in five years? Is it a bunch of chips in a package? I... » read more

New End Markets, More Demand For Complex Chips


Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

Choosing Which Tasks To Optimize In Chips


The optimization of one or more tasks is an important aspect of every SoC created, but with so many options now on the table it is often unclear which is best. Just a few years ago, most people were happy to buy processors from the likes of Intel, AMD and Nvidia, and IP cores from Arm. Some even wanted the extensibility that came from IP cores like Tensilica and ARC. Then, in 2018, John Henn... » read more

Using GPUs In Semiconductor Manufacturing


Massive simulation and curvilinear shapes are forcing the photomask industry to rethink what types of chips work best. Aki Fujimura, CEO of D2S, talks about what happens when shapes printed on a mask are closer to what actually gets printed, how GPUs can be used to accelerate CPUs in single instruction/multiple data (SIMD) operations, and why pixel data is different from other data. » read more

Chiplets Enter The Supercomputer Race


Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Accelerating Circuit Simulation 10x With GPUs


By Samad Parekh (Synopsys) and Srinivas Kodiyalam (NVIDIA) Many aspects of semiconductor design and verification have an ever-growing “need for speed” that has outpaced the performance improvements available by running on CPUs. Electronic design automation (EDA) companies have responded by creating smarter software algorithms to improve simulation time, sometimes at the expense of relaxe... » read more

Growth Spurred By Negatives


The success and health of the semiconductor industry is driven by the insatiable appetite for increasingly complex devices that impact every aspect of our lives. The number of design starts for the chips used in those devices drives the EDA industry. But at no point in history have there been as many market segments driving innovation as there are today. Moreover, there is no indication this... » read more

Photomask Challenges At 3nm And Beyond


Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

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