Chip Industry Technical Paper Roundup: Feb. 13


New technical papers added to Semiconductor Engineering’s library this week. [table id=197 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


By Jesse Allen, Linda Christensen, and Liz Allan.  The Biden administration plans to invest more than $5B  for semiconductor R&D and workforce support, including in the National Semiconductor Technology Center (NSTC), as part of the rollout of the CHIPS Act. Today's announcement included at least hundreds of millions for the NSTC workforce efforts, including creating a Workforce Cente... » read more

Generating And Evaluating HW Verification Assertions From Design Specifications Via Multi-LLMs


A technical paper titled “AssertLLM: Generating and Evaluating Hardware Verification Assertions from Design Specifications via Multi-LLMs” was published by researchers at Hong Kong University of Science and Technology. Abstract: "Assertion-based verification (ABV) is a critical method for ensuring design circuits comply with their architectural specifications, which are typically describe... » read more

Chip Industry’s Technical Paper Roundup: June 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=109 /] Further Reading Technical Paper Home » read more

Extreme Fast Charging by Regulating Lithium-Ion Batteries’ Self-Generated Heat Via Active Thermal Switching


A technical paper titled “Extreme fast charging of commercial Li-ion batteries via combined thermal switching and self-heating approaches” was published by researchers at Lawrence Berkeley National Laboratory, the University of California, Berkeley, and the Hong Kong University of Science and Technology. Abstract: "The mass adoption of electric vehicles is hindered by the inadequate ext... » read more

The Next Incarnation Of EDA


The EDA industry has incrementally addressed issues as they arise in the design of electronic systems, but is there about to be a disruption? Academia is certainly seeing that as a possibility, but not all of them see it happening for the same reason. The academic community questioned the future of EDA at the recent Design Automation Conference. Rather than EDA as we know it going away, they... » read more

Power/Performance Bits: June 28


Making uniform wafers Scientists from the Korea Institute of Machinery & Materials (KIMM) and Nanyang Technological University Singapore (NTU Singapore) propose a technique that combines nanotransfer printing with metal-assisted chemical etching to improve wafer uniformity and increase yield. The researchers used a chemical-free nanotransfer printing technique that transfers gold nanost... » read more

GaN ICs Wanted for Power, EV Markets


Circuits built with discrete GaN components may get the job done, but fully integrated GaN circuits remain the ultimate goal because they would offer many of the same advantages as integrated silicon circuits. These benefits include lower cost as the circuit footprint is scaled, and reduced parasitic resistance and capacitance with shorter interconnect runs. In addition, improved device perf... » read more

Power/Performance Bits: Nov. 2


GaN CMOS ICs Researchers from the Hong Kong University of Science and Technology (HKUST) are working to increase the functionality available to wide bandgap gallium nitride (GaN) electronics. GaN is frequently used in power electronics, such as power converters and supplies. However, GaN CMOS technology has been hampered by the difficulties in implementing p-channel transistors and integrat... » read more

Power/Performance Bits: June 4


Flexible high-temp dielectric Researchers at Rice University, Georgia Institute of Technology, and Cornell University developed a new high-temperature dielectric nanocomposite for flexible electronics, energy storage, and electric devices that combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The polymer nanofibers act as a structural reinforcement, w... » read more

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