tag: Hong Kong University of Science and Technology

GaN Power Devices Power Up
By Katherine Derbyshire - 03 Jun, 2026 - Comments: 0

Key Takeaways: GaN devices are gaining traction due to their ability to tolerate higher voltages. New approaches such as chiplets offer faster switching with less loss. The first applications to benefit from GaN will be low-voltage consumer devices; industrial applications require more work. As electrical power displaces fossil fuels in more applications, system designers ne... » read more

Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding (U. of Edinburgh, Peking U., Cambridge et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design," was published by researchers at University of Edinburgh, Peking University, University of Cambridge, University of Chinese Academy of Sciences, and the Hong Kong University of Science and Technology. Abstract "Large language model (LLM) decoding is a majo... » read more

Research Bits: Jan. 6
By Jesse Allen - 06 Jan, 2026 - Comments: 0

Ultrathin ferroelectric capacitors Researchers from the Institute of Science Tokyo and Canon ANELVA Corporation built an ultrathin ferroelectric memory capacitor stack using scandium-substituted aluminum nitride ((Al,Sc)N) thin films with platinum electrodes. The total thickness is just 30nm: a 20nm ferroelectric layer sandwiched between 5nm platinum top and bottom electrodes. “Previous r... » read more

Chip Industry Technical Paper Roundup: Nov. 26
By Emma Riverso - 26 Nov, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=494 /] Find more semiconductor research papers here. » read more

Edge AI Safety: Agentic AI Architecture That Leverages 3D To Integrate A Dedicated Safety Layer (Princeton, HKUST, NC State Univ.)
By Technical Paper Link - 17 Nov, 2025 - Comments: 0

A new technical paper titled "3D Guard-Layer: An Integrated Agentic AI Safety System for Edge Artificial Intelligence" was published by researchers at Princeton University, Hong Kong University of Science and Technology, and North Carolina State University. Abstract "AI systems have found a wide range of real-world applications in recent years. The adoption of edge artificial intelligence, ... » read more

Government Funding For Chip Design Tools Spreads
By Liz Allan - 28 Aug, 2025 - Comments: 0

Governments around the globe are starting to invest more heavily in chip design tools and related research as part of an effort to boost on-shore chip production, opening new opportunities for startups and established EDA companies. Those cash infusions, which are being doled out in the U.S., Europe, and Asia, are part of a growing recognition of the importance of design automation tools wit... » read more

Chip Industry Technical Paper Roundup: July 7
By Linda Christensen - 07 Jul, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=445 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review
By The SE Staff - 16 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis. Newly proposed U.S. legislation called the Chip Security Act would use location verification tracking as a tool to help combat chip smuggling. This follows a report by the Economist that showed Taiwan exports of advanced chips to Malaysia in the first quarter has nearly reached 2024 totals, heightening concerns that China... » read more

Improving GaN Device Architectures
By Katherine Derbyshire - 23 Jan, 2025 - Comments: 0

As the universe of applications for power devices grows, designers are finding that no single semiconductor can cover the full range of voltage and current requirements. Instead, combination circuits use different materials for different parts of the overall operating range. GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and... » read more

Research Bits: Jan. 7
By Jesse Allen - 07 Jan, 2025 - Comments: 0

Deep UV microLED for maskless lithography Researchers from the Hong Kong University of Science and Technology, Southern University of Science and Technology, and the Suzhou Institute of Nanotechnology developed an aluminum gallium nitride deep-ultraviolet microLED display array for maskless lithography.  They also built a maskless lithography prototype platform. "The team achieved key brea... » read more

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