tag: IBM

The Week In Review: Manufacturing
By Mark LaPedus - 26 Sep, 2014 - Comments: 0

Is the sky falling on the ATE market? The ATE market is expected to hit $2.8 billion in 2014, up from $2.28 billion in 2013, according to Pacific Crest Securities. “Overall, we are now modeling overall semiconductor test demand to decline by 2% in 2015, a significant change from our previous estimate of up 10%,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “Te... » read more

Manufacturing Bits: Sept. 23
By Mark LaPedus - 23 Sep, 2014 - Comments: 0

The annual IEEE International Electron Devices Meeting (IEDM) will take place in San Francisco from Dec. 15-17. As usual, there will be presentations on the latest technologies in a number of fields, such as semiconductors, bio‐sensors, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, among others. Here’s just some of the papers that will be pr... » read more

Materials Matter
By SEMI - 18 Sep, 2014 - Comments: 0

By Pushkar Apte Despite formidable technical and economic challenges, the semiconductor technology engine continues steaming ahead, changing the way we work and play in amazing ways. This engine primarily ran on the “Moore’s Law track” for nearly half a century – but now, the tracks are diverging for digital logic and memory, and “More-than-Moore” devices. Continuing progress requi... » read more

Making Chips Run Faster
By Ed Sperling - 11 Sep, 2014 - Comments: 3

For all the talk about low power, the real focus of most chipmakers is still performance. The reality is that OEMs might be willing to sacrifice increasing performance for longer battery life, but they will rarely lower performance to reach that goal. This is more obvious for some applications than others. A machine monitor probably isn’t the place where performance will make much of a dif... » read more

More Problems Ahead
By Ed Sperling - 10 Sep, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss future scaling problems with Lars Liebmann, a fellow at IBM; Adam Brand, managing director of transistor technology at Applied Materials; Karim Arabi, vice president of engineering at Qualcomm; and Srinivas Banna, a fellow for advanced technology architecture at GlobalFoundries. SE: Where are the most severe issues these days? Is it on the design... » read more

Blog Review: Aug. 27
By Ann Mutschler - 27 Aug, 2014 - Comments: 0

In the spirit of making a positive social contribution, and to recognize employees for their contributions to the local community, Applied Materials’ chairman Mike Splinter accepted the ALS Ice Bucket Challenge. Nice job, Mike! With development work underway on the 10nm process node, and questions about getting there with conventional lithography, Cadence’s Richard Goering invites us to ... » read more

More Problems Ahead
By Ed Sperling - 25 Aug, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss future scaling problems with Lars Liebmann, a fellow at IBM; Adam Brand, managing director of transistor technology at Applied Materials; Karim Arabi, vice president of engineering at Qualcomm; and Srinivas Banna, a fellow for advanced technology architecture at GlobalFoundries. SE: There seems to be some debate in this group about whether we’r... » read more

Different Approaches Emerge For Stacking Die
By Ed Sperling - 21 Aug, 2014 - Comments: 1

The concept of stacking die to shorten wires, improve performance, and reduce the amount of energy required to drive signals has been in research for at least the past dozen years at both IBM and Intel. And depending upon whom you ask, it could be another 2 to 10 years before it becomes a mainstream packaging approach—if it happens at all. At least part of the confusion stems from how you ... » read more

Blog Review: Aug. 20
By Ed Sperling - 20 Aug, 2014 - Comments: 0

Ansys’ Bill Vandermark highlights the top five engineering articles of the week. Check out the “Sprouting Baby Monitor.” This may be a sign of what the IoT is really good for. You can also use your cat (or dog or even your kids) to hack your neighbor’s Wi-Fi. Cadence’s Richard Goering says gaps may be narrowing between available tools and what’s needed for 3D-IC design. Now all w... » read more

Manufacturing Bits: Aug. 19
By Mark LaPedus - 19 Aug, 2014 - Comments: 0

28nm brain chips DARPA-funded researchers have developed a 28nm chip that mimics the brain. The low-power chip is inspired by the neuronal structure of the brain. Designed by researchers at IBM under DARPA’s Systems of Neuromorphic Adaptive Plastic Scalable Electronics (SyNAPSE) program, the chip consists of 5.4 billion transistors. Built on Samsung’s 28nm foundry process, the chip has ... » read more

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