Week In Review: Manufacturing, Test


Notes from the fabs Intel warned the “scope and pace" of the Ohio fab buildout could be impacted due to U.S. Congress’ inaction on funding the $52 billion CHIPS Act. The facility was announced in January with an initial phase investment of more than $20 billion with a larger expansion up to $100 billion over the next decade. The initial phase is not expected to be impacted, other than a de... » read more

Week In Review: Manufacturing, Test


Node scaling wars are revving up, although much of the action is happening where most people can't see it — inside of research labs. This is difficult stuff, which makes delivery dates difficult to pinpoint, and no one wants to give away their competitive position or commit to a timeline they can't keep. Billions of dollars of leading-edge research — funded by pure-play foundry TSMC, IDM... » read more

Week In Review: Design, Low Power


Tools, design, chips Altair, a provider of software and cloud services for CAE, HPC, simulation, and data analysis, acquired Concept Engineering, a provider of automatic schematic generation tools, electronic circuit and wire harness visualization platforms that provide on-the-fly visual rendering, and electronic design debug solutions. “Concept Engineering’s advanced, reactive visualizati... » read more

High-NA EUV May Be Closer Than It Appears


High-NA EUV is on track to enable scaling down to the Angstrom level, setting the stage for chips with even higher transistor counts and a whole new wave of tools, materials, and system architectures. At the recent SPIE Advanced Lithography conference, Mark Phillips, director of lithography hardware and solutions at Intel, reiterated the company’s intention to deploy the technology in high... » read more

Week In Review: Manufacturing, Test


Broadcom announced it will acquire cloud computing and virtualization company VMware for about $61 billion in cash and stock, and assume $8 billion in VMware net debt. If all goes as planned, the Broadcom Software Group will rebrand and operate as VMware. “The combined solutions will enable customers, including leaders in all industry verticals, greater choice and flexibility to build, run, m... » read more

Week In Review: Design, Low Power


EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Manufacturing, Test


GlobalFoundries launched GF Labs, an “open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications.” Greg Bartlett, GF's senior vice president of technology, engineering at quality, said the goal is to develop and exp... » read more

Deep Tech Drives Semiconductor Sustainability


SEMI spoke with Luc Van den hove, president and CEO at Imec, about semiconductor sustainability, healthcare trends, and deep tech, and their implications for the semiconductor industry. Van den hove shared his views ahead of his keynote presentation at SEMI Industry Strategy Symposium Europe (ISS Europe), on May 30, 2022, in Brussels, Belgium. Join us at the event to meet experts from Imec... » read more

Week In Review: Manufacturing, Test


It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

BEOL Integration For The 1.5nm Node And Beyond


As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for new process flows. Process modifications to improve RC performance, reduce edge placement error, and enable challenging manufacturing processes will all be required. To address these challenges, we investigated th... » read more

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