tag: imec

The Week In Review: Sept. 3
By Mark LaPedus - 03 Sep, 2013 - Comments: 0

By Mark LaPedus The cellular chip supplier landscape is littered with corpses. So will 4G lead to the destruction of Qualcomm and Intel? That’s highly unlikely, according to a blog from Strategy Analytics. “With the recent announcement of a multimode LTE chipset from Intel, it seems likely that Qualcomm and Intel will maintain their status as the top two cellular radio chipset suppliers in... » read more

The Week In Review: July 22
By Mark LaPedus - 22 Jul, 2013 - Comments: 0

By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

The Alphabet Soup Of New Material Science
By Joanne Itow - 18 Jul, 2013 - Comments: 0

By Joanne Itow Escaping the scorching Arizona temperatures is only one reason why I always look forward to Semicon West. This year’s event was packed with an exceptional variety of activities and vendors. What was the most memorable take-away from the show? There were plenty of panels, presentation and networking discussions on the 450mm wafer transition and EUV. But the biggest thing that I... » read more

450mm: Out Of Sync
By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus The IC industry has been talking about it for ages, but vendors are finally coming to terms with a monumental shift in the business. The vast changes involve a pending and critical juncture, where the 450mm wafer size transition, new device architectures and other technologies will likely converge at or near the same time. In one possible scenario, 450mm fabs are projected ... » read more

Manufacturing Bits: July 16
By Mark LaPedus - 16 Jul, 2013 - Comments: 0

Photon Chips Harvard University, the Massachusetts Institute of Technology (MIT) and the Vienna University of Technology have devised an all-optical transistor controlled by a single photon. The optical transistor could enable the development of photonic quantum gates and deterministic multi-photon entanglement. For years, researchers have been looking to develop an optical transistor, whe... » read more

Consortium Mania Sweeps 450mm Landscape
By Mark LaPedus - 20 Jun, 2013 - Comments: 0

By Mark LaPedus In the mid-1990s, the semiconductor industry embarked on a costly and problematic migration from 200mm to 300mm wafer fabs. At the time, the 300mm development efforts were in the hands of two groups—Sematech and a Japanese-led entity. The equipment industry was on the outside looking in. And as a result, the migration from 200mm to 300mm fabs was out of sync and a nightma... » read more

Shades Of Green
By Ed Sperling - 09 May, 2013 - Comments: 0

By Ann Steffora Mutschler Ask five people in the electronics industry what ‘green’ means and you are sure to get five different answers. In the datacenter, the definition is a little clearer because big iron draws so many amps. But at the SoC level where does the industry stand? The answer is as multifaceted as an SoC itself, with some answers based more on one-upmanship than real met... » read more

Design-For-DSA Industry Begins To Assemble
By Mark LaPedus - 18 Apr, 2013 - Comments: 0

By Mark LaPedus The industry is aggressively pursuing directed self-assembly (DSA) as an alternative patterning technology for future chip designs. DSA, which enables fine pitches through the use of block copolymers, is in the R&D pilot line stage today. The fab tools, process flows and materials are basically ready, but there are still several challenges to bring the technology from th... » read more

Directed Self-Assembly Grows Up
By Mark LaPedus - 21 Mar, 2013 - Comments: 1

By Mark LaPedus At last year’s SPIE Advanced Lithography conference, Christopher Bencher, a member of the technical staff at Applied Materials, said the buzz surrounding directed self-assembly (DSA) technology resembled the fervor generated at the famous Woodstock rock concert in 1969. This was clearly evident from the tumultuous and free-flowing movement that threatened the status quo o... » read more

Getting Ready For High-Mobility FinFETs
By Mark LaPedus - 21 Feb, 2013 - Comments: 0

By Mark LaPedus The IC industry entered the finFET era in 2011, when Intel leapfrogged the competition and rolled out the newfangled transistor technology at the 22nm node. Intel hopes to ramp up its second-generation finFET devices at 14nm by year’s end, with plans to debut its 11nm technology by 2015. Hoping to close the gap with Intel, silicon foundries are accelerating their efforts t... » read more

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