tag: Indian Institute of Science

Research Bits: Nov. 25
By Jesse Allen - 25 Nov, 2024 - Comments: 0

3D-printed ESD protection Researchers from Lawrence Livermore National Laboratory developed a printable elastomeric silicone foam for electronics packaging that provides both mechanical and electrostatic discharge (ESD) protection. The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled rheological properties such as elast... » read more

Chip Industry Week In Review
By The SE Staff - 08 Nov, 2024 - Comments: 0

Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

Chip Industry Technical Paper Roundup: July 22
By Linda Christensen - 22 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=245 /] More ReadingTechnical Paper Library home » read more

NVMs: In-Memory Fine-Grained Integrity Verification Technique (Intel Labs, IISc)
By Technical Paper Link - 16 Jul, 2024 - Comments: 0

A new technical paper titled "iMIV: in-Memory Integrity Verification for NVM" was published by researchers at Intel Labs and Indian Institute of Science (IISc), Bengaluru. Abstract "Non-volatile Memory (NVM) could bridge the gap between memory and storage. However, NVMs are susceptible to data remanence attacks. Thus, multiple security metadata must persist along with the data to protect th... » read more

Research Bits: July 24
By Jesse Allen - 24 Jul, 2023 - Comments: 0

Protons improve ferroelectric memory Researchers from King Abdullah University of Science and Technology (KAUST), Qingdao University, and Zhejiang University developed a method to produce multiple phase transitions in ferroelectric materials, which could increase storage capacity for neuromorphic memory. The approach uses proton-mediation of the ferroelectric material indium selenide. The r... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 14 Jul, 2023 - Comments: 0

SEMICON West returned in force this week, with a focus on AI and deep learning  in semiconductor manufacturing, security, heterogenous ICs, and the march toward a $1 trillion chip market. Lam Research President and CEO, Tim Archer, opened with the keynote presentation. Fig. 1: SEMICON West panel: AI’s influence on growth, China-U.S. trade war, and the importance of climate policy were... » read more

Chip Industry’s Technical Paper Roundup: Oct. 4
By Linda Christensen - 04 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=55 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Feb, 2022 - Comments: 0

Tools & IP Ansys updated its product suite, adding new tools and workflows in Ansys 2022 R1. It adds Phi Plus meshing technology to improve simulation of PCB and complex 3D IC packaging. It also introduces RedHawk-SC SigmaDVD, a statistically realistic modeling technique to identify the worst-case dynamic voltage-drop in hours and make it possible to achieve near 100% coverage of all relev... » read more

Hybrid architecture based on two-dimensional memristor crossbar array and CMOS integrated circuit for edge computing
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "The fabrication of integrated circuits (ICs) employing two-dimensional (2D) materials is a major goal of semiconductor industry for the next decade, as it may allow the extension of the Moore’s law, aids in in-memory computing and enables the fabrication of advanced devices beyond conventional complementary metal-oxide-semiconductor (CMOS) technology. However, most circuital demons... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 25 Jun, 2021 - Comments: 0

Lots more fabs and capacity The chip industry sees opportunity in shortages, and is racing to meet demand. SEMI reports 19 new worldwide high-volume fabs already have started construction, or will start by end of this year, and another 10 are scheduled in 2022. “Equipment spending for these 29 fabs is expected to surpass $140 billion over the next few years as the industry pushes to addre... » read more

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