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Chip Industry’s Technical Paper Roundup: Oct. 4


New technical papers added to Semiconductor Engineering’s library this week. [table id=55 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Week In Review: Design, Low Power


Tools & IP Ansys updated its product suite, adding new tools and workflows in Ansys 2022 R1. It adds Phi Plus meshing technology to improve simulation of PCB and complex 3D IC packaging. It also introduces RedHawk-SC SigmaDVD, a statistically realistic modeling technique to identify the worst-case dynamic voltage-drop in hours and make it possible to achieve near 100% coverage of all relev... » read more

Hybrid architecture based on two-dimensional memristor crossbar array and CMOS integrated circuit for edge computing


Abstract "The fabrication of integrated circuits (ICs) employing two-dimensional (2D) materials is a major goal of semiconductor industry for the next decade, as it may allow the extension of the Moore’s law, aids in in-memory computing and enables the fabrication of advanced devices beyond conventional complementary metal-oxide-semiconductor (CMOS) technology. However, most circuital demons... » read more

Week In Review: Manufacturing, Test


Lots more fabs and capacity The chip industry sees opportunity in shortages, and is racing to meet demand. SEMI reports 19 new worldwide high-volume fabs already have started construction, or will start by end of this year, and another 10 are scheduled in 2022. “Equipment spending for these 29 fabs is expected to surpass $140 billion over the next few years as the industry pushes to addre... » read more

Manufacturing Bits: June 23


Fan-out gas sensors At the recent IEEE Electronic Components and Technology Conference (ECTC), the University of California at Los Angeles (UCLA) and the Indian Institute of Science presented a paper on the development of a wearable MEMS gas sensor device based on a flexible wafer-level fan-out packaging technology. Researchers have demonstrated a gas sensor device or a personal environment... » read more

Manufacturing Bits: March 13


Gallium oxide substrates Kyma Technologies has rolled out a substrate line based on crystalline beta-phase gallium oxide (β-Ga2O3) materials. [caption id="attachment_24132458" align="alignleft" width="300"] Single crystal gallium oxide (ß-Ga2O3) substrates (Source: Kyma)[/caption] Crystalline beta gallium oxide is a promising wide bandgap semiconductor material. It has a large bandgap... » read more

Power/Performance Bits: April 4


Self-sustaining microbial fuel cell Researchers at Binghamton University developed the first micro-scale self-sustaining microbial fuel cell, which generates power through the symbiotic interactions of two types of bacteria. A mixed culture of phototrophic and heterotrophic bacteria were placed in a 90-microliter cell chamber, or about one-fifth the size of a teaspoon. Phototrophic bacter... » read more