tag: Indian Institute of Technology Madras

White-Box Fuzzer With Static Analysis To Detect And Locate Timing Vulnerabilities In RISC-V Processors 
By Technical Paper Link - 20 Feb, 2024 - Comments: 0

A technical paper titled “WhisperFuzz: White-Box Fuzzing for Detecting and Locating Timing Vulnerabilities in Processors” was published by researchers at Indian Institute of Technology Madras, Texas A&M University, and Technische Universität Darmstadt. Abstract: "Timing vulnerabilities in processors have emerged as a potent threat. As processors are the foundation of any computing s... » read more

Suitability of FeFET-Based CAM Cells For Storage-Class Memory, Under Junction Temperature Variations
By Technical Paper Link - 15 Jan, 2024 - Comments: 0

A technical paper titled “Ferroelectric Field Effect Transistors–Based Content-Addressable Storage-Class Memory: A Study on the Impact of Device Variation and High-Temperature Compatibility” was published by researchers at Fraunhofer Institute for Photonic Microsystems (IPMS) and Indian Institute of Technology Madras (IIT Madras). Abstract: "Hafnium oxide (HfO2)-based ferroelectric fiel... » read more

Predicting Defect Properties In Semiconductors With Graph Neural Networks
By Technical Paper Link - 24 Oct, 2023 - Comments: 0

A technical paper titled “Accelerating Defect Predictions in Semiconductors Using Graph Neural Networks” was published by researchers at Purdue University, Indian Institute of Technology (IIT) Madras, GE Research, and National Institute of Standards and Technology (NIST). Abstract: "Here, we develop a framework for the prediction and screening of native defects and functional impurities i... » read more

Chip Industry’s Technical Paper Roundup: May 16
By Linda Christensen - 16 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

28nm-HKMG-Based FeFET Devices For Synaptic Applications
By Technical Paper Link - 09 May, 2023 - Comments: 0

A technical paper titled "28 nm high-k-metal gate ferroelectric field effect transistors based synapses- A comprehensive overview" was published by researchers at Fraunhofer-Institut für Photonische Mikrosysteme IPMS, Indian Institute of Technology Madras, and GlobalFoundries. Abstract This invited article we present a comprehensive overview of 28 nm high-k-metal gate-based ferroelectric f... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21
By Linda Christensen - 21 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Co-Design View of Cross-Bar Based Compute-In-Memory
By Technical Paper Link - 15 Mar, 2023 - Comments: 0

A new review paper titled "Compute in-Memory with Non-Volatile Elements for Neural Networks: A Review from a Co-Design Perspective" was published by researchers at Argonne National Lab, Purdue University, and Indian Institute of Technology Madras. "With an over-arching co-design viewpoint, this review assesses the use of cross-bar based CIM for neural networks, connecting the material proper... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Nov, 2022 - Comments: 0

Chip design Fraunhofer IIS/EAS implemented the Bunch of Wires (BoW) standard-based interface IP from the Open Compute Project (OCP) on Samsung's 5nm technology. The effort is intended to make chiplets more feasible for products with small and medium-sized production runs and determine the need for additional uniform standards in the future, such as for die-to-die bonding. “As part of t... » read more

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