tag: Intel

Transistor Options Beyond 3nm
By Mark LaPedus - 15 Feb, 2018 - Comments: 18

Despite a slowdown in chip scaling amid soaring costs, the industry continues to search for a new transistor type 5 to 10 years out—particularly for the 2nm and 1nm nodes. Specifically, the industry is pinpointing and narrowing down the transistor options for the next major nodes after 3nm. Those two nodes, called 2.5nm and 1.5nm, are slated to appear in 2027 and 2030, respectively, accord... » read more

The Week in Review: IoT
By Jeff Dorsch - 09 Feb, 2018 - Comments: 0

Finance BroadLink has raised $54.4 million in Series D funding from Citic Private Equity Funds Management. Baidu and Libai Group participated in the new round. BroadLink will use the money to expand its artificial intelligence and Internet of Things units, while also acquiring or investing in companies involved in smart home devices. Aperio Systems of Haifa, Israel, has received $4.5 millio... » read more

Bridging Machine Learning’s Divide
By Brian Bailey - 08 Feb, 2018 - Comments: 0

There is a growing divide between those researching [getkc id="305" comment="machine learning"] (ML) in the cloud and those trying to perform inferencing using limited resources and power budgets. Researchers are using the most cost-effective hardware available to them, which happens to be GPUs filled with floating point arithmetic units. But this is an untenable solution for embedded infere... » read more

Cheaper Packaging Options Ahead
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Feb, 2018 - Comments: 0

Fab tools SEMI has announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent. In a letter to the CEOs of more than 2,000 global SEMI member companies, Ajit Manocha, SEMI’s president and CEO, called on the executives to act together to attract workers and develop the workforce vital to industry growth. In addition, it is a turbu... » read more

The Road To Autonomy
By Jeff Dorsch - 01 Feb, 2018 - Comments: 0

Visions of autonomous driving were everywhere at CES 2018 in Las Vegas and the North American International Auto Show in Detroit. Still, while there is progress in the technology, it will be years before the average motorist can get a fully autonomous vehicle. Advanced driver-assistance systems are gaining in complexity and scope, representing steps toward automated driving. At CES 2018, ... » read more

Manufacturing Bits: Jan. 30
By Mark LaPedus - 30 Jan, 2018 - Comments: 0

SRC’s new R&D centers The Semiconductor Research Corp. has launched a network of research centers within its recently-announced Joint University Microelectronics Program (JUMP). SRC officially launched the 5-year, $200 million program on Jan. 1. With various research centers, the mission of JUMP is to lay the groundwork that extends the viability of Moore’s Law through 2040. The idea is... » read more

The Week In Review: Design
By Jesse Allen - 26 Jan, 2018 - Comments: 0

Security Addressing the Meltdown and Spectre speculative execution vulnerabilities has not gone smoothly. Intel's firmware update caused unexpected behavior and a higher than expected number of reboots for its Haswell and Broadwell chips, leading the company to recommend users stop patching until an updated version of the patch is available. Microsoft's attempts to fix the issue left some W... » read more

Hedging The Chip Industry
By Ed Sperling - 25 Jan, 2018 - Comments: 1

The chip industry has changed significantly since the last big downturn. And while there is no indication a downturn is on the horizon, analysts are beginning to ask questions about what comes next. Inventory is building at systems companies because of weaknesses in some of the key markets such as mobile phones and tablet computers, and there is a growing risk of trade wars due to recently impo... » read more

Blog Review: Jan. 24
By Jesse Allen - 24 Jan, 2018 - Comments: 0

Mentor's Rich Edelman shares some tips for debugging complex UVM testbenches containing multiple agents, multiple checkers, and new HDL. Synopsys' Prasad Subudhi K. S. explains the PCIe PIPE 4.4.1 specification and the major improvements since 4.3, including better optimization in data flow and ultra-low power operations. Cadence's Paul McLellan steps back to before the Meltdown and Spect... » read more

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