tag: Intel

DARPA CHIPS Program Pushes For Chiplets
By Ann Mutschler - 14 Sep, 2017 - Comments: 0

While the semiconductor industry plugs away at More Than Moore innovation, the U.S. government is guiding its own SoC development. A new program kicked off last year called ‘Common Heterogeneous Integration and IP Reuse Strategies’ or CHIPS to take its own approach the incredibly high cost of SoC design and manufacturing. DARPA said it recognizes that the explosive growth in mobile and t... » read more

Frenzy At 10/7nm
By Ann Mutschler - 14 Sep, 2017 - Comments: 1

The number of chipmakers rushing to 10/7nm is rising, despite a slowdown in Moore's Law scaling and the increased difficulty and cost of developing chips at the most advanced nodes. How long this trend continues remains to be seen. It's likely that 7/5nm will require new manufacturing equipment, tools, materials and transistor structures. Beyond that, there is no industry-accepted roadmap, m... » read more

Blog Review: Sept. 13
By Jesse Allen - 13 Sep, 2017 - Comments: 0

Mentor's Andrew Macleod points to some important things to consider when beginning an automotive IC project and why differentiation, not commoditization, should be the goal. Synopsys' Amit Paunikar examines the architecture changes that make LPDDR4 faster while consuming less power. Cadence's Paul McLellan shares highlights from CDNLive Boston, from the latest in silicon photonics to how ... » read more

Survey: Optimism Grows for EUV
By Mark LaPedus - 11 Sep, 2017 - Comments: 1

The optimism is growing for extreme ultraviolet (EUV) lithography in the market, according to a pair of new surveys released by the eBeam Initiative, which also revealed some new and surprising data about mask writing tools and other photomask technology. In one of the surveys from the [getentity id="22818" e_name="eBeam Initiative"], respondents revealed that they are more optimistic than e... » read more

Get Ready For In-Mold Electronics
By Jeff Dorsch - 11 Sep, 2017 - Comments: 1

Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

Inside Panel-Level Fan-Out Technology
By Mark LaPedus - 11 Sep, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss panel-level fan-out packaging technology with Tanja Braun, deputy group manager at the Fraunhofer Institute for Reliability and Microintegration IZM, and Michael Töpper, business development manager at Fraunhofer IZM. Braun is responsible for the Panel Level Packaging Consortium at Fraunhofer IZM, as well as the group manager for assembly and encap... » read more

The Week In Review: IoT
By Jeff Dorsch - 01 Sep, 2017 - Comments: 0

Finance Dublin-based Cubic Telecom has taken in €40 million (about $47.6 million) in Series C funding, bringing its total funding to €75 million (around $89.25 million). Audi Electronics Venture and Qualcomm are existing investors participating in the new round of funding, joined by new investors Ireland Strategic Investment Fund and Valid Soluciones Tecnologicas SAU. Cubic will use the mo... » read more

Blog Review: Aug. 30
By Jesse Allen - 30 Aug, 2017 - Comments: 0

Cadence's Meera Collier explains machine learning, unsupervised algorithms, and why Facebook's recently publicized AI chatbot conversation isn't as inscrutable as it sounds. Synopsys' Robert Vamosi considers recently proposed legislation which seeks to mitigate the risk of botnets commandeering IoT devices used in the U.S. government, including limiting the use of hard-coded passwords and ce... » read more

Tools To Design CNNs
By Ann Mutschler - 28 Aug, 2017 - Comments: 2

Convolutional neural networks are becoming a mainstay in machine learning and artificial intelligence, allowing a network of distributed sensors to collect data and send them to a central brain for processing. This is a relatively simple idea in comparison to today's technology, and the idea of the [getkc id="261" kc_name="convolutional neural network"] has been around for some time. But bui... » read more

What’s New At Hot Chips
By Jeff Dorsch - 25 Aug, 2017 - Comments: 0

By Jeff Dorsch & Ed Sperling Machine learning, artificial intelligence and neuromorphic computing took center stage at Hot Chips 2017 this week, a significant change from years past where the focus was on architectures that addressed improvements in speed and performance for standard compute problems. What is clear, given the focus of presentations, is that the bleeding edge of comput... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy