tag: Intel

Packaging Enters New Phase
By Ed Sperling - 07 Aug, 2017 - Comments: 0

The race is on to make advanced packaging less expensive than shrinking everything down onto the same die—much less expensive, in fact. Following several years of speculation and rather shaky market predictions at the beginning of this decade, packaging houses and foundries spent the last four years proving that packaging really does provide a viable alternative to shrinking die in terms o... » read more

Cheaper Fan-Outs Ahead
By Mark LaPedus - 07 Aug, 2017 - Comments: 6

Packaging houses continue to ramp up fan-out wafer-level packages in the market, but customers want lower cost fan-out products for a broader range of applications, such as consumer, RF and smartphones. So in R&D, the industry for some time has been developing next-generation fan-out using a panel-level format, a technology that could potentially lower the cost of fan-out. But there are ... » read more

A Tale of Two Testers
By Jeff Dorsch - 07 Aug, 2017 - Comments: 0

David Tacelli, president and CEO of Xcerra, was excited. His company’s reception for customers (and the press) at the Trou Normand restaurant in San Francisco’s hip South of Market neighborhood was going very well. Gourmet salames and other tasty foods were on offer, along with fine wines and craft ales and beers. He gleefully pointed out to editors that the product to be introduced at t... » read more

The Week In Review: IoT
By Jeff Dorsch - 04 Aug, 2017 - Comments: 0

Legislation Four senators plan to introduce a bipartisan bill that would require federal government vendors to provide Internet-connected devices and equipment that is patchable and conforms to industry cybersecurity standards. Such products must not have unchangeable passwords or known security vulnerabilities. The bill was drafted with expert advice from the Atlantic Council and Harvard Univ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Jul, 2017 - Comments: 0

Chipmakers UMC has generated sales from its recently-announced 14nm finFET technology. The foundry vendor also plans to enter the 22nm process technology market. UMC will join other players in the 22nm arena, such as GlobalFoundries, Intel and TSMC. “So we do have a plan to introduce our 22nm as well and it will be available around 2018,” said Jason Wang, the newly appointed co-president o... » read more

The Secret Life Of Accelerators
By Ed Sperling - 27 Jul, 2017 - Comments: 0

Accelerator chips increasingly are providing the performance boost that device scaling once provided, changing basic assumptions about how data moves within an electronic system and where it should be processed. To the outside world, little appears to have changed. But beneath the glossy exterior, and almost always hidden from view, accelerator chips are becoming an integral part of most des... » read more

What’s After FinFETs?
By Mark LaPedus - 24 Jul, 2017 - Comments: 3

Chipmakers are readying their next-generation technologies based on 10nm and/or 7nm finFETs, but it's still not clear how long the finFET will last, how long the 10nm and 7nm nodes for high-end devices will be extended, and what comes next. The industry faces a multitude of uncertainties and challenges at 5nm, 3nm and beyond. Even today, traditional chip scaling continues to slow as process ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Jul, 2017 - Comments: 1

Fab equipment ASML posted strong sales in the quarter and is apparently nearly sold out of scanners based on extreme ultraviolet (EUV) lithography, according to analysts. “ASML posted strong 2Q results and 2Q guidance, providing further evidence that demand remains high for semiconductor equipment,” said Weston Twigg, an analyst with KeyBanc Capital Markets, in a research note. “Demand d... » read more

5 Takeaways From Semicon
By Mark LaPedus - 20 Jul, 2017 - Comments: 0

At the recent Semicon West trade show in San Francisco, there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs, equipment and packaging. Clearly, though, the show is much smaller with fewer attendees, as compared to past years. Most of the big companies no longer have booths. Hardly any have press events or med... » read more

Foundries Accelerate Auto Efforts
By Mark LaPedus - 20 Jul, 2017 - Comments: 0

Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

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