tag: Intel

The Week In Review: Manufacturing
By Mark LaPedus - 05 May, 2017 - Comments: 0

Fab tools, test and packaging Brewer Science has sold its so-called Cee semiconductor processing equipment business. A former employee, Russ Pagel, has formed a new company, Cost Effective Equipment, to take over ownership and operate the Cee business. The new company, which will remain in Rolla, Mo., will sell spin coaters, bake plates, bonders and other systems. Taiwan’s Ministry of E... » read more

Verification And The IoT
By Ed Sperling - 04 May, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss what impact the IoT will have on the design cycle, with Christopher Lawless, director of external customer acceleration in [getentity id="22846" e_name="Intel"]'s Software Services Group; David Lacey, design and verification technologist at Hewlett Packard Enterprise; Jim Hogan, managing partner at Vista Ventures; Frank Schirrmeister, senior group d... » read more

Blog Review: May 3
By Jesse Allen - 03 May, 2017 - Comments: 0

Cadence's Paul McLellan shares highlights from a recent IRDS panel, including changing the assumptions about computing and looking for the next "killer app." Synopsys' Meenakshy Ramachandran introduces the array of improvements in HDMI 2.1, from higher bandwidth to Dynamic HDR. Mentor's Minghui Fan checks out advancements in optical proximity correction and resolution enhancement technolo... » read more

Inside Lithography And Masks
By Mark LaPedus - 01 May, 2017 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="IMEC"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cov... » read more

Blog Review: April 26
By Jesse Allen - 26 Apr, 2017 - Comments: 0

Cadence's Paul McLellan provides an introduction to single-event effects and the challenges created when high-energy neutrons bombard chips. Synopsys' Robert Vamosi looks at the strange turf war between two worms battling for control of IoT security cameras. Mentor's Ayan Pahwa contends that it's the duty of IoT device developers to take security as paramount factor and provide good secur... » read more

22nm Process War Begins
By Mark LaPedus - 23 Apr, 2017 - Comments: 1

Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

Cloud Computing Chips Changing
By Ann Mutschler - 19 Apr, 2017 - Comments: 1

An explosion in cloud services is making chip design for the server market more challenging, more diverse, and much more competitive. Unlike datacenter number crunching of the past, the cloud addresses a broad range of applications and data types. So while a server chip architecture may work well for one application, it may not be the optimal choice for another. And the more those tasks beco... » read more

Blog Review: April 19
By Jesse Allen - 19 Apr, 2017 - Comments: 0

Mentor's Tom Fitzpatrick explains what the Portable Stimulus standard will do, what it won't, and why the choice of input language defined by the standard matters. Cadence's Paul McLellan listens in as IRDS chairman Paolo Gargini explains how long it takes technology breakthroughs to make out of the lab and into high-volume manufacturing. Synopsys' Robert Vamosi points to the recent sound... » read more

Power/Performance Bits: April 18
By Jesse Allen - 18 Apr, 2017 - Comments: 0

Cooling hotspots Engineers at Duke University and Intel developed a technology to cool hotspots in high-performance electronics. The new technology relies on a vapor chamber made of a super-hydrophobic floor with a sponge-like ceiling. When placed beneath operating electronics, moisture trapped in the ceiling vaporizes beneath emerging hotspots. The vapor escapes toward the floor, taking hea... » read more

The Hunt For A Low-Power PHY
By Brian Bailey - 17 Apr, 2017 - Comments: 0

Physics has been on the side of chipmakers throughout most of the lifetime of [getkc id="74" comment="Moore's Law"], but when dealing with the world outside the chip, physics is working against them. Pushing data at ever-faster rates through boards and systems consumes increasing amounts of power, but the power budget for chips has not been increasing. Could chips be constrained by their int... » read more

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