Tech Forecast: Fab Processes To Watch Through 2040

By Laura Peters - 16 Mar, 2023 - Comments: 0

The massive proliferation of semiconductors in more markets, and more applications within those markets, is expected to propel the industry to more than $1 trillion by 2030. But over the next 17 years, semiconductors will reach well beyond the numbers, changing the way people work, how they communicate, and how they measure and monitor their health and well-being. Chips will be the enabling ... » read more

Hardware-Based Confidential Computing (NIST)

By Technical Paper Link - 10 Mar, 2023 - Comments: 0

NIST has published a draft report, titled “Hardware Enabled Security: Hardware-Based Confidential Computing,” which presents an approach for managing machine identities for protection against malware and other security vulnerabilities. Comments are due April 10, 2023. Abstract "Organizations employ a growing volume of machine identities, often numbering in the thousands or millions per ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Linda Christensen - 10 Mar, 2023 - Comments: 0

Rambus will begin selling Arm's CryptoCell embedded security platform and CryptoIsland root-of-trust cores, setting the stage for a much broader push by Rambus into security for a wide range of connected devices, and ultimately into security as a service. Under the terms of the deal, Rambus' customers will be able to license Arm IP directly from Rambus. For Arm's existing customers, there will ... » read more

What Makes RISC-V Verification Unique?

By Brian Bailey - 09 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss the verification of RISC-V processors with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, senior director of alliances partner... » read more

Standards: The Next Step For Silicon Photonics

By Karen Heyman - 07 Mar, 2023 - Comments: 0

Testing silicon photonics is becoming more critical and more complicated as the technology is used in new applications ranging from medicine to cryptography, lidar, and quantum computing, but how to do that in a way that is both consistent and predictable is still unresolved. For the past three decades, photonics largely has been an enabler for high-speed communications, a lucrative market t... » read more

Chip Industry’s Technical Paper Roundup: Mar. 6

By Linda Christensen - 06 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=84 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

CXL-Based Memory Pooling System Meets Cloud Performance Goals And Significantly Reduces DRAM Cost

By Technical Paper Link - 05 Mar, 2023 - Comments: 0

A technical paper titled "Pond: CXL-Based Memory Pooling Systems for Cloud Platforms" was published by researchers at Virginia Tech, Intel, Microsoft Azure, Google, and Stone Co. Abstract "Public cloud providers seek to meet stringent performance requirements and low hardware cost. A key driver of performance and cost is main memory. Memory pooling promises to improve DRAM utilization and t... » read more

Agile HW Design: Fully Automatic Equivalence Checking Workflow

By Technical Paper Link - 03 Mar, 2023 - Comments: 0

A new technical paper titled "An Equivalence Checking Framework for Agile Hardware Design" was published by researchers at Portland State University and Intel. Abstract "Agile hardware design enables designers to produce new design iterations efficiently. Equivalence checking is critical in ensuring that a new design iteration conforms to its specification. In this paper, we introduce an eq... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 Mar, 2023 - Comments: 0

Apple plans to spend an additional €1 billion (~$1.1B) over the next six years to expand its Munich, Germany-based Silicon Design Centre, including the construction of a new research facility. "The expansion of our European Silicon Design Centre will enable an even closer collaboration between our more than 2,000 engineers in Bavaria working on breakthrough innovations, including custom sil... » read more

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tag: Intel

Tech Forecast: Fab Processes To Watch Through 2040

Hardware-Based Confidential Computing (NIST)

Week In Review: Auto, Security, Pervasive Computing

What Makes RISC-V Verification Unique?

Standards: The Next Step For Silicon Photonics

Chip Industry’s Technical Paper Roundup: Mar. 6

CXL-Based Memory Pooling System Meets Cloud Performance Goals And Significantly Reduces DRAM Cost

Agile HW Design: Fully Automatic Equivalence Checking Workflow

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Design, Low Power

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