Week In Review, Manufacturing, Test


Samsung announced initial production of its 3nm process node, which uses a gate-all-around (nanosheet) transistor structure that the company calls Multi-Bridge-Channel FET (MBCFET). The first-generation 3nm process can reduce power consumption by up to 45% compared with a 5nm process, as well as improve performance by 23% and reduce area by 16%, according to the company. The second-generation 3... » read more

EDA Gaps At The Leading Edge


Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

Week In Review: Manufacturing, Test


Notes from the fabs Intel warned the “scope and pace" of the Ohio fab buildout could be impacted due to U.S. Congress’ inaction on funding the $52 billion CHIPS Act. The facility was announced in January with an initial phase investment of more than $20 billion with a larger expansion up to $100 billion over the next decade. The initial phase is not expected to be impacted, other than a de... » read more

Why Hardware-Dependent Software Is So Critical


Hardware and software are two sides of the same coin, but they often live in different worlds. In the past, hardware and software rarely were designed together, and many companies and products failed because the total solution was unable to deliver. The big question is whether the industry has learned anything since then. At the very least, there is widespread recognition that hardware-depen... » read more

Technical Paper Round-Up: June 21


New technical papers added to Semiconductor Engineering’s library this week. [table id=34 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Hardware Dynamic IFT Mechanism That Scales to Complex Open-Source RISC-V Processors


New technical paper titled "CellIFT: Leveraging Cells for Scalable and Precise Dynamic Information Flow Tracking in Hardware Designs" by researchers at ETH Zurich and Intel.  Paper to be presented at USENIX Security 2022 (August 10-12, 2022) in Boston, MA, USA. Partial Abstract "We introduce CELLIFT, a new design point in the space of dynamic IFT [Information flow tracking] for hardware. C... » read more

Variation Making Trouble In Advanced Packages


Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go wrong and when. Concerns about variation traditionally have been confined to the most advanced nodes, where transistor density is highest and where manufacturing processes are still being fine-t... » read more

High-NA EUV May Be Closer Than It Appears


High-NA EUV is on track to enable scaling down to the Angstrom level, setting the stage for chips with even higher transistor counts and a whole new wave of tools, materials, and system architectures. At the recent SPIE Advanced Lithography conference, Mark Phillips, director of lithography hardware and solutions at Intel, reiterated the company’s intention to deploy the technology in high... » read more

Chips Can Boost Malware Immunity


Security is becoming an increasingly important design element, fueled by increasingly sophisticated attacks, the growing use of technology in safety-critical applications, and the rising value of data nearly everywhere. Hackers can unlock automobiles, phones, and smart locks by exploiting system design soft spots. They even can hack some mobile phones through always-on circuits when they are... » read more

Week in Review: Manufacturing, Test


Breaking the Logjam The U.S. government’s delay in funding strategic chip capacity is threatening supply chains that are critical to national security. In fact, classified meetings are being held this week on the subject. Meanwhile, recognizing that time is of the essence, a group of billionaires has backed the “America’s Frontier Fund,” a non-profit group that aims to spur U.S. chipma... » read more

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