tag: Intel

Blog Review: May 25
By Jesse Allen - 25 May, 2022 - Comments: 0

Coventor's Michael Hargrove points to the need for a new generation of deep-submicron CMOS circuits that can operate at deep-cryogenic temperatures to achieve a quantum integrated circuit where the array of qubits is integrated on the same chip as the CMOS electronics required to read the state of the qubits. Ansys' Marc Swinnen warns about dynamic voltage drop as ultra-low supply voltages, ... » read more

Standardizing Chiplet Interconnects
By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 20 May, 2022 - Comments: 0

GlobalFoundries launched GF Labs, an “open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications.” Greg Bartlett, GF's senior vice president of technology, engineering at quality, said the goal is to develop and exp... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 May, 2022 - Comments: 0

Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability
By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

New End Markets, More Demand For Complex Chips
By Ed Sperling - 16 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

Week In Review: Design, Low Power
By Jesse Allen - 13 May, 2022 - Comments: 0

Tools & IP MIPS announced its first products based on the RISC-V ISA. The eVocore IP cores are designed to provide a flexible foundation for heterogeneous compute, supporting combinations of eVocore processors as well as other accelerators, with a Coherence Manager that maintains L2 cache and system-level coherency between all cores, main memory, and I/O devices. They target high-performan... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 13 May, 2022 - Comments: 0

Automotive, mobility Fraunhofer IIS has opened a five-kilometer (3.11-mile) 5G test bed for automotive 5G applications near the city of Rosenheim in Bavaria, Germany. A closed 5G network with multiple base stations covers the test track, where connected cars can be tested under real conditions. “The automotive test bed is designed specially for developers and users that want to test new conn... » read more

Lots Of Data, But Uncertainty About What To Do With It
By Ed Sperling - 09 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management in heterogeneous designs, where sensors produce a flood of data, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University... » read more

Rambus To Buy Hardent
By Ed Sperling - 05 May, 2022 - Comments: 0

Rambus inked a deal to buy Hardent, an engineering services company, in order to accelerate Rambus' push into the CXL arena. Compute Express Link (CXL), developed primarily by Intel before being turned into an open industry standard, allows memory to be disaggregated within a data center and shared across multiple servers. This, in turn, lets data centers control how critical resources are a... » read more

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