tag: Intel

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Mar, 2021 - Comments: 0

Chipmakers and OEMs Micron will cease development of 3D XPoint, a next-generation memory technology. Micron also plans to sell a fab that produces 3D XPoint chips. For some time, Intel and Micron have co-developed 3D XPoint, which is based on phase-change memory technology. Intel sells solid-state storage drives (SSDs) using 3D XPoint. In a fab located in Utah, Micron is producing this memo... » read more

Week In Review: Design, Low Power
By Jesse Allen - 12 Mar, 2021 - Comments: 0

Tools & IP Codasip unveiled three commercially licensed add-ons to the Western Digital SweRV Core EH1, aiming to allow it to be designed into a wider range of applications. The SweRV Core EH1 is a 32-bit, dual-issue, RISC-V ISA core with a 9-stage pipeline, open-sourced through CHIPS Alliance. The add-ons offer a floating-point unit (FPU) that supports the RISC-V single precision [F] and d... » read more

Tradeoffs To Improve Performance, Lower Power
By Ann Mutschler - 11 Mar, 2021 - Comments: 0

Generic chips are no longer acceptable in competitive markets, and the trend is growing as designs become increasingly heterogeneous and targeted to specific workloads and applications. From the edge to the cloud, including everything from vehicles, smartphones, to commercial and industrial machinery, the trend increasingly is on maximizing performance using the least amount of energy. This ... » read more

Preventing Chips From Burning Up During Test
By Bryon Moyer - 09 Mar, 2021 - Comments: 1

It’s become increasingly difficult to manage the heat generated during IC test. Absent the proper mitigations, it’s easy to generate so much heat that probe cards and chips literally can burn up. As a result, implementing temperature-management techniques is becoming a critical part of IC testing. “We talk about systems, saying the system is good,” said Arun Krishnamoorthy, senior... » read more

Cloud Vs. On-Premise Analytics
By Anne Meixner - 09 Mar, 2021 - Comments: 2

The immense and growing volume of data generated in chip manufacturing is forcing chipmakers to rethink where to process and store that data. For fabs and OSATs, this decision is not one to be taken lightly. The proprietary nature of yield, performance, and other data, and corporate policies to retain tight control of that data, have so far limited outsourcing to the cloud. But as the amount... » read more

Security Provisioning Moves Out Of The Factory
By Bryon Moyer - 04 Mar, 2021 - Comments: 1

Security credentials traditionally have been provisioned during chip manufacturing, often as a final part of the testing process. That's starting to change. Logistics management can be improved by pushing that process out — even as far as the on-boarding process. And simpler on-boarding can hide most of the details from the user. “The IT approach to provisioning IoT devices has primar... » read more

Chiplets For The Masses
By Brian Bailey - 03 Mar, 2021 - Comments: 2

Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

More Silicon Wafer Consolidation
By Mark LaPedus - 18 Feb, 2021 - Comments: 0

The silicon wafer business typically flies under the radar, but it’s a fundamental part of the semiconductor business. Every chipmaker needs to buy silicon wafers in one size or another. In the supply chain, silicon wafer vendors produce and sell bare or raw silicon wafers to chipmakers, who in turn process them into chips. So it’s important to keep an eye on the market. Today, the s... » read more

Power Converter Chip Research Booms
By Katherine Derbyshire - 18 Feb, 2021 - Comments: 0

Power electronics are booming, fueled by demand ranging from induction chargers for wearable and portable electronics, to charging stations for electric vehicles. An estimated 80% of all U.S. electricity will pass through some form of power converter by 2030, said Yogesh Ramadass, director of power management at Texas Instruments' Kilby Labs. Transportation applications, in particular, deman... » read more

Breaking The 2nm Barrier
By Mark LaPedus - 18 Feb, 2021 - Comments: 4

Chipmakers continue to make advancements with transistor technologies at the latest process nodes, but the interconnects within these structures are struggling to keep pace. The chip industry is working on several technologies to solve the interconnect bottleneck, but many of those solutions are still in R&D and may not appear for some time — possibly not until 2nm, which is expected t... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy