tag: Intel

Latest IC Outlook: More Uncertainty
By Mark LaPedus - 26 May, 2020 - Comments: 0

So far in 2020, it’s been a difficult period in the semiconductor industry amid the Covid-19 pandemic outbreak and other issues. And heading into the second half of 2020, the industry faces more challenges, if not uncertainty, in the market. Many segments in the semiconductor industry face some headwinds, but there might be some positive news in the equipment business. To be sure,... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 22 May, 2020 - Comments: 0

Edge, cloud, data center Cadence added new verification IP (VIP) for hyperscalar data centers that supports CXL – Compute Express Link, HBM3, and Ethernet 802.3ck. The VIP are part of Cadence’s Verification Suite. Cadence also released IP for 56G long-reach SerDes on TSMC’s N7 and N6 process technologies. Many Mentor, a Siemens Business, IC design tools are now certified TSMC’s N5 a... » read more

Spiking Neural Networks: Research Projects or Commercial Products?
By Bryon Moyer - 18 May, 2020 - Comments: 2

Spiking neural networks (SNNs) often are touted as a way to get close to the power efficiency of the brain, but there is widespread confusion about what exactly that means. In fact, there is disagreement about how the brain actually works. Some SNN implementations are less brain-like than others. Depending on whom you talk to, SNNs are either a long way away or close to commercialization. Th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 May, 2020 - Comments: 0

Chipmakers TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, will utilize TSMC’s 5nm technology and will produce 20,000 wafers per month. TSMC’s total spending on this project will be approximately $12 billion from 2021 to 2029. Construction is planned to start in 2021 with production targeted to begin in 202... » read more

‘More Than Moore’ Reality Check
By Ann Mutschler - 14 May, 2020 - Comments: 1

The semiconductor industry is embracing multi-die packages as feature scaling hits the limits of physics, but how to get there with the least amount of pain and at the lowest cost is a work in progress. Gaps remain in tooling and methodologies, interconnect standards are still being developed, and there are so many implementations of packaging that the number of choices is often overwhelming. ... » read more

Which Chip Interconnect Protocol Is Better?
By Ed Sperling - 11 May, 2020 - Comments: 0

Semiconductor Engineering sat down to the discuss the pros and cons of the Compute Express Link (CXL) and the Cache Coherent Interconnect for Accelerators (CCIX) with Kurt Shuler, vice president of marketing at Arteris IP; Richard Solomon, technical marketing manager for PCI Express controller IP at Synopsys; and Jitendra Mohan, CEO of Astera Labs. What follows are excerpts of that conversation... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 May, 2020 - Comments: 0

Chipmakers The Trump administration has held talks with Intel and TSMC to build more leading-edge fabs in the U.S., according to the Wall Street Journal and other news outlets. IC Insights has released its rankings of the top-10 chip vendors in terms of sales for the first quarter. Intel remains in first place, followed by Samsung and TSMC. The big surprise is China-based fabless IC supplie... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 08 May, 2020 - Comments: 0

Automotive Imagination Technologies and BAIC Capital have formed an automotive joint venture to create a new automotive fabless semiconductor company focused on China as a client. The JV will be headquartered in the Zhongguancun Integrated Circuit Design Park in Beijing, China, with Bravo Lee serving as CEO. The JV will license IP and software from Imagination to create automotive-grade SoCs. ... » read more

The Great Auto Race Goes Internal
By Ed Sperling - 07 May, 2020 - Comments: 1

Carmakers have discovered a new competitive threat, and it's coming from within their own supply chain. In the past, OEMs leveraged their suppliers to compete against other OEMs, often tapping the same Tier 1 players as their competitors because there was enough differentiation in acceleration time, braking distance, cabin amenities and price to create distinctive brands. Porsche is known fo... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 01 May, 2020 - Comments: 0

Data center, 5G security Nvidia won approval for its Mellanox Technologies Ltd. deal from China, according to an article on Bloomberg. Mellanox chips split up and manage AI datasets for parallel processing, which can be used in data centers for computing. Rambus has released security for 800 Gigbit Ethernet MAC (media access control) for enhanced data center and 5G infrastructure. It secure... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy