tag: Intel

Blog Review: Feb. 26
By Jesse Allen - 26 Feb, 2020 - Comments: 0

Cadence's Paul McLellan listens in as Warren Savage of the University of Maryland explains how security threats are increasing as IoT devices broaden the attack surface and why the semiconductor industry needs to take responsibility. Synopsys' Taylor Armerding argues that a key first step to complying with new and upcoming consumer privacy laws should be ensuring cybersecurity to protect aga... » read more

Chiplet Momentum Rising
By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Brighter Future For Photonics
By Brian Bailey - 13 Feb, 2020 - Comments: 3

Photons increasingly are taking over where electrons are failing in communications, but mixing the two never has been easy. There always have been two potential implementation paths — building each on its own substrate and then stacking them, or building them on a single substrate. The tradeoff between the two solutions is more complex than it may initially appear, and ongoing improvements... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 Feb, 2020 - Comments: 0

Internet of Things SEMI-FlexTech launched six flexible hybrid electronics (FHE) projects, collaborating with U.S. Army Research Laboratory (ARL), to accelerate innovations in sensor and sensor systems. Participating in the projects are American Semiconductor, Inc., University of Texas El Paso, Tekscan, PARC, Alertgy, and Iowa State University, among others. Some of the projects include develop... » read more

Hardware Attack Surface Widening
By Ed Sperling - 06 Feb, 2020 - Comments: 0

An expanding attack surface in hardware, coupled with increasing complexity inside and outside of chips, is making it far more difficult to secure systems against a variety of new and existing types of attacks. Security experts have been warning about the growing threat for some time, but it is being made worse by the need to gather data from more places and to process it with AI/ML/DL. So e... » read more

Blog Review: Jan. 29
By Jesse Allen - 29 Jan, 2020 - Comments: 0

Mentor's Shivani Joshi introduces the basics of PCB layout and the importance of being familiar with a manufacturer's specs. Cadence's Paul McLellan takes a look at why Design Technology Co-Optimization is increasingly necessary as 3nm approaches and new transistor types like CFET and gate-all-around are on the horizon. Synopsys' Sai Karthik Madabhushi recounts an alarming incident that h... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Jan, 2020 - Comments: 0

Market research What are the hot chip markets for 2020? IC Insights released its rankings of sales growth rates for each of the 33 IC product categories defined by the World Semiconductor Trade Statistics (WSTS) organization. “After posting the two worst growth rates among all IC product categories in 2019, NAND flash and DRAM are forecast to be among the top three fastest-growing IC segment... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 Jan, 2020 - Comments: 0

Xilinx filed a patent infringement countersuit against Analog Devices, alleging infringement of eight U.S. patents including technologies involving serializers/deserializers (SerDes), high-speed ADCs and DACs, as well as mixed-signal devices targeting 5G and other markets. The counterclaims are in response to Analog Devices' December lawsuit alleging unauthorized use by Xilinx of eight ADI pate... » read more

Is This The Year Of The Chiplet?
By Ed Sperling - 23 Jan, 2020 - Comments: 2

Customizing chips by choosing pre-characterized — and most likely hardened IP — from a menu of options appears to be gaining ground. It's rare to go to a conference these days without hearing chiplets being mentioned. At a time when end markets are splintering and more designs are unique, chiplets are viewed as a way to rapidly build a device using exactly what is required for a particul... » read more

Finding Defects In EUV Masks
By Mark LaPedus - 23 Jan, 2020 - Comments: 0

Extreme ultraviolet (EUV) lithography is finally in production at advanced nodes, but there are still several challenges with the technology, such as EUV mask defects. Defects are unwanted deviations in chips, which can impact yield and performance. They can crop up during the chip manufacturing process, including the production of a mask or photomask, sometimes called a reticle. Fortunately... » read more

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