tag: Intel

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

The Next Semiconductor Revolution
By Ed Sperling - 15 Jan, 2019 - Comments: 0

What will drive the next semiconductor revolution? When you ask people with decades of experience in semiconductor manufacturing and software development, the answers include everything from AI and materials to neuromorphic architectures. Federico Faggin, designer of the world's first microprocessor; Terry Brewer, president and CEO of Brewer Science; Sanjay Natarajan, corporate vice presi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Jan, 2019 - Comments: 0

Trade and fab equipment The SEMI Industry Strategy Symposium (ISS) this week opened with the theme “Golden Age of Semiconductor: Enabling the Next Industrial Revolution.” The annual three-day conference gave the year’s first outlook of the global electronics manufacturing industry. Click here for a recap. SEMI and Imec are joining forces to drive innovation and deepen industry align... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 11 Jan, 2019 - Comments: 0

Internet of Things Automotive, health care, manufacturing, and the public sector could be transformed this year by Internet of Things technology, Bob Violino writes. Taqee Khaled, director of strategy at Nerdery, a digital business consultancy, predicts 2019 will see rapid evolution in enterprise IoT pilot initiatives and implementations. "This acceleration is due, in part, to advances in manu... » read more

Data Vs. Physics
By Ed Sperling - 10 Jan, 2019 - Comments: 0

The surge of data from nearly ubiquitous arrays of sensors is changing the dynamics of where and how that data is processed. There is simply too much data to send everything to a centralized processing facility in the cloud, and even 5G won't provide enough bandwidth to handle all of this data. This has big implications on a much broader scale. Data is valuable. And while clean data is more ... » read more

Blog Review: Jan. 9
By Jesse Allen - 09 Jan, 2019 - Comments: 0

Cadence's Paul McLellan considers the challenges facing copper interconnects as resistance gets harder to deal with and the pros and cons of potential replacement materials. Mentor's Harry Foster digs into how FPGA design and verification engineers spend their time, and why the time designers spend designing has increased. Synopsys' Taylor Armerding contends that the way we use passwords ... » read more

Quantum Issues And Progress
By Katherine Derbyshire - 07 Jan, 2019 - Comments: 3

Quantum computing is showing significant promise, and research is beginning to move from the earliest stages to a deeper understanding of what works best commercially and why. On paper, quantum computing algorithms are potentially revolutionary. They suggest a way to solve some problems more quickly and more accurately than conventional computers ever could. But out in the real world of prac... » read more

What’s the Right Path For Scaling?
By Mark LaPedus - 02 Jan, 2019 - Comments: 1

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Dec, 2018 - Comments: 0

Tariffs The United States and China are in the midst of a trade war. New data shows that tariffs on imported Chinese products now cost the technology industry an additional $1 billion per month, according to the Consumer Technology Association (CTA). Nearly 70% of tariffs paid by the hi-tech industry come from the $200 billion product list enacted Sep. 24. Tariffs on CTA-identified tech pro... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Dec, 2018 - Comments: 0

Chipmakers Foxconn is in talks to build a fab in Zhuhai, China, according to a report from Nikkei. The fab, to cost $9 billion, would make chips for Foxconn and outside companies, the report said, which says the company will enter the foundry business. The European Commission has approved funding for 1.75 billion euros ($2 billion) of public investment for projects in the microelectronics... » read more

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