tag: Intel

Week In Review: Design, Low Power
By Jesse Allen - 05 Apr, 2019 - Comments: 0

Tools & IP Cadence entered the system design and analysis market with the release of Clarity 3D Solver, which creates S-parameter models for use in signal integrity, power integrity, and electromagnetic compliance analysis. The tool uses a distributed adaptive meshing approach for cloud and on-premises distributed computing and it optimized to distribute a job across multiple low-cost comp... » read more

Blog Review: April 3
By Jesse Allen - 03 Apr, 2019 - Comments: 0

Synopsys' Taylor Armerding contends that as the IoT becomes more ubiquitous, the threat of cyber-physical attacks is rising, with the potential for a domino effect if even simple devices are compromised in large enough quantities. Mentor's Colin Walls considers the move away from programming on bare metal with the rise of drivers and RTOSes and when it makes sense to still use the old method... » read more

Blog Review: Mar. 27
By Jesse Allen - 27 Mar, 2019 - Comments: 0

Rambus' Steven Woo takes a look at the memory requirements of neural networks and why some companies are using on-chip memory while others are using HBM2 or GDDR6. Cadence's Lana Chan  observes growing momentum for NVMe and highlights some new features in the latest specification that are pushing mainstream adoption forward. Mentor's Matthew Ballance contends that when it comes to adopti... » read more

Data-Driven Verification Begins
By Ed Sperling - 27 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss data-driven verification with Yoshi Watanabe, senior software architect at Cadence; Hanan Moller, systems architect at UltraSoC; Mark Conklin, principal verification engineer at Arm; and Hao Chen, senior design engineer at Intel. What follows are excerpts of that conversation, which was conducted in front of a live audience at DVCon. (L-R) Yosh... » read more

Single Vs. Multi-Patterning EUV
By Mark LaPedus - 25 Mar, 2019 - Comments: 5

Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

Materials M&A Mania
By Mark LaPedus - 21 Mar, 2019 - Comments: 0

The electronics materials business has seen a wave of mergers and acquisitions in recent times. Clearly, it’s important to keep tabs on this industry. Vendors in the electronics materials business are critical to the supply chain—they provide the key gases, materials and other products for various industries, such as display, MEMS, packaging, semiconductor and others. But it takes a s... » read more

Blog Review: Mar. 20
By Jesse Allen - 20 Mar, 2019 - Comments: 0

Cadence's Paul McLellan argues that rapid improvements in the performance of general-purpose computing led to a lack of innovation in domain-specific architectures, but as scaling slows, they're entering a new golden age. In a video, Mentor's Colin Walls takes a look at the use of floating point in an embedded application and some of the pitfalls associated with it. Synopsys' Taylor Armer... » read more

Manufacturing Bits: March 19
By Mark LaPedus - 19 Mar, 2019 - Comments: 0

Exascale computers Intel and the U.S. Department of Energy (DOE) have set plans to develop and deliver the first exascale supercomputer in the United States. The system, called Aurora, will provide an exaFLOP of performance or a quintillion floating point computations per second. Targeted for delivery in 2021, the system is being developed at DOE’s Argonne National Laboratory. The system ... » read more

Isambard Analysis of HPC-Optimized Arm Processors
By Arm - 13 Mar, 2019 - Comments: 0

Written by Simon McIntosh‐Smith, James Price, Tom Deakin, Andrei Poenaru (all from the High Performance Computing Research Group, Department of Computer Science, University of Bristol, Bristol, UK) In this paper, we present performance results from Isambard, the first production supercomputer to be based on Arm CPUs that have been optimized specifically for HPC. Isambard is the first Cray ... » read more

Blog Review: Mar. 13
By Jesse Allen - 13 Mar, 2019 - Comments: 0

Mentor's Tom Fitzpatrick questions whether deep learning approaches can really help improve coverage in modern, complex designs. Cadence's Paul McLellan listens in at MWC as Huawei chairman Guo Ping defends the company's security practices and shows where its heading in 5G. Synopsys' Eric Huang checks out the newly announced USB4 specification, changes to previous USB names, and a few things ... » read more

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