Week In Review: Manufacturing, Test


Intel Mark Bohr, a senior fellow and director of process architecture and integration at Intel, is retiring, according to the company. Bohr, who will retire at the end of February 2019, held various technology positions during his 41-year career at Intel. Here is a quick bio on Bohr. Others have also recently retired from Intel’s manufacturing unit amid a massive reorganization in the depart... » read more

Security, Scaling and Power


If anyone has doubts about the slowdown and increasing irrelevance of Moore's Law, Intel's official unveiling of its advanced packaging strategy should leave little doubt. Inertia has ended and the roadmap is being rewritten. Intel's discussion of advanced packaging is nothing new. The company has been public about its intentions for years, and started dropping hints back when Pat Gelsinger ... » read more

Packaging Biz Faces Challenges in 2019


The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Blog Review: Dec. 5


Mentor's Harry Foster digs into verification effectiveness in FPGA projects and what it means that so many non-trivial bugs escape into production. Cadence's Paul McLellan checks out an effort to integrate photonics with CMOS and find the tradeoffs in three different approaches, plus the view of photonics as applied to military aircraft. Synopsys' Richard Solomon shares some highlights on... » read more

Manufacturing Bits: Dec. 4


Probing Mars Equipped with a CCD camera, a temperature probe and a seismic instrument, NASA's robotic system or lander recently landed on Mars. On Nov. 26, the robotic system--dubbed the Interior Exploration using Seismic Investigations, Geodesy and Heat Transport (InSight)--landed on Mars after nearly a seven-month, 300-million-mile (485-million-kilometer) journey from Earth. The lander t... » read more

Making Sure A Heterogeneous Design Will Work


An explosion of various types of processors and localized memories on a chip or in a package is making it much more difficult to verify and test these devices, and to sign off with confidence. In addition to timing and clock domain crossing issues, which are becoming much more difficult to deal with in complex chips, some of the new devices are including AI, machine learning or deep learning... » read more

AI Chip Architectures Race To The Edge


As machine-learning apps start showing up in endpoint devices and along the network edge of the IoT, the accelerators that make AI possible may look more like FPGA and SoC modules than current data-center-bound chips from Intel or Nvidia. Artificial intelligence and machine learning need powerful chips for computing answers (inference) from large data sets (training). Most AI chips—both tr... » read more

Getting Down To Business On Chiplets


Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Overcoming Gender Stereotypes In Tech


Gender inequality in the workplace is more complex and deep-rooted than most studies have shown, and efforts to address those issues are only scratching the surface. The problem runs deeper than just moving women into upper management. It extends all the way through organizations in ways that aren't always obvious. “I've been talking to senior women in engineering and junior women in en... » read more

Foundries Prepare For Battle At 22nm


After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

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