Interconnect Power


By Barry Pangrle Applied Materials announced its latest version of nano-porous low-k dielectric technology called Black Diamond 3 last month at Semicon West. What really caught my ear though was the marketing claim that 1/3 of total chip power consumption (really energy) is in the interconnect. I thought about this a bit, and certainly for some designs this seemed to easily be quite po... » read more

NoC Your SoCs Off


By Ed Sperling The network on a chip (NoC) approach is gaining ground as an essential part of a system on a chip (SoC), providing the same kind of time-to-market advantage that well-tested intellectual property blocks provide. This follows almost eight years of hype about NoCs potential with little to show for it. Times have changed and there appear to be two main drivers, one technological a... » read more

Making A Multicore System Work


Making all the pieces work together in a multicore system requires a deep understanding of the technology, lots of different layers of synthesis, and some incredibly complex testing strategies.   System-Level Design sat down with James Aldis, system on chip architect for Texas Instruments wireless business unit; Charles Janac, president and CEO of Arteris, Drew Wingard, CTO of Sonics, and ... » read more

Making A Multicore System Work


If you think designing a single-core system is hard, designing multicore systems is multiple times harder. Connecting all the pieces together and making them work properly, if not together, is one of the hardest tasks design engineers and architects will ever face. System-Level Design tracked down some of the experts in this field and sat them down around a table to discuss what’s going... » read more

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