Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility The Lancet’s Road Safety 2022 report estimates that 1.35 million people die every year from road traffic injuries, with more than 50 million injured or disabled. Low-income and middle-income countries (LMICs) have the most deaths, accounting for 93% of the world's fatalities on roads. The four main risk factors for road injuries are speeding, impaired driving (drunk driv... » read more

DDR5: How Faster Memory Speeds Shape The Future


Faster data processing requires faster memory. Double data rate synchronous dynamic random-access memory (DDR SDRAM) enables the world’s computers to work with the data in memory. DDR is used everywhere — not just in servers, workstations, and desktops, but it is also embedded in consumer electronics, automobiles, and other system designs. DDR SRAM is used for running applications and d... » read more

Week In Review: Design, Low Power


RISC-V RISC-V International announced four new specification and extension approvals. Efficient Trace for RISC-V defines an approach to processor tracing that uses a branch trace. RISC-V Supervisor Binary Interface architects a firmware layer between the hardware platform and the operating system kernel using an application binary interface in supervisor mode to enable common platform services... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility The U.S. Department of Transportation’s National Highway Traffic Safety Administration (NHTSA) published a notice of proposed rulemaking (NPRM) to change the regulations on event data recorders (EDRs) to extend the EDR recording period for “timed data metrics from 5 seconds of pre-crash data at a frequency of 2 Hz to 20 seconds of pre-crash data at a frequency of 10 Hz... » read more

IC Reliability Burden Shifts Left


Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it's a stray alpha particle that flips a memory bit, or some long-dormant software bugs or latent hardware defects that suddenly cause problems, it's now up to the chip industry to prevent these problems in the first place, and solve them when they do arise. ... » read more

The Essential Signal Generator Guide Building A Solid Foundation In RF — Part 1


Eliminate uncertainties and doubts from your test results with a reliable signal source. Engineers designing consumer wireless, military communications, or radar devices face an ongoing bandwidth crunch in spectrum filled with interference. An accurate signal generator offers precise and stable test signals for characterizing your device under test (DUT). It also lets you apply impairments t... » read more

Week In Review: Design, Low Power


Tools, design, chips Altair, a provider of software and cloud services for CAE, HPC, simulation, and data analysis, acquired Concept Engineering, a provider of automatic schematic generation tools, electronic circuit and wire harness visualization platforms that provide on-the-fly visual rendering, and electronic design debug solutions. “Concept Engineering’s advanced, reactive visualizati... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility U.S. National Highway Traffic Safety Administration (NHTSA) release its first crash reports from ADAS (advanced driver assistance systems, i.e., SAE Level 2) and ADS (automated driving systems, i.e., SAE Levels 3-5).  The systems had to be in use at least 30 seconds before the crash in order for it to be reportable. The car may have had the system turned off at the time ... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Lightyear, an automotive company based in the Netherlands, announced its solar car, the Lightyear 0, which goes into production this year. The car has a Worldwide Harmonised Light Vehicle Test Procedure (WLTP) range of 625 kilometers/388 miles and can charge itself while driving or parked, using double curved solar arrays on its roof. The daily charging adds 70 kilometers/... » read more

Keeping IC Packages Cool


Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

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