Wanted: New Metrology Funding Models

By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus The shift toward the 20nm node and beyond will require new and major breakthroughs in chip manufacturing. Most of the attention centers around lithography, gate stacks, interconnects, strain engineering and design-for-manufacturing (DFM). Lost in the conversation are two other critical but overlooked pieces in the manufacturing puzzle—wafer inspection and metrology. ... » read more

Reaching For The Reset Button In Lithography

By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus Amid ongoing delays and setbacks, extreme ultraviolet (EUV) lithography and multi-beam e-beam have both missed the 10nm logic node. So for the present, chipmakers must take the brute force route at 10nm by using 193nm immersion with multiple patterning. Now, it’s time to hit the reset button. For the 7nm node, chipmakers currently are lining up the lithographic competition... » read more

Behind The Mask

By Ed Sperling - 18 Oct, 2012 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss the current and future photomask manufacturing challenges with Franklin Kalk, executive vice president and chief technology officer at Toppan Photomasks, one of the world’s largest merchant mask makers. SMD: The outlook for the photomask industry is for 2% growth in 2012. Do you agree with that? Kalk: That’s ... » read more

Capping Tools Tame Electromigration

By Mark LaPedus - 31 Jul, 2012 - Comments: 0

By Mark LaPedus The shift towards the 28nm node and beyond has put the spotlight back on the interconnect in semiconductor manufacturing. In chip scaling, the big problem in the interconnect is resistance-capacitance (RC). Another, and sometimes forgotten, issue is electromigration. “Electromigration gets worse in device scaling,” said Daniel Edelstein, an IBM Fellow and manager of BE... » read more

FD-SOI Foundations Ready, Say Semi Execs

By Various Writers - 09 Sep, 2011 - Comments: 0

By Adele Hars SOI (especially fully depleted “FD-SOI”) was a hot topic in the video and audio interviews that Debra Vogler of SST released recently. Here are brief summaries of the most important SOI-related interviews – with top brass from Leti, Soitec, KT, EVG and Qcept – that she made at Semicon West ’11. (If you need a quick backgrounder on FD-SOI basics, see this exp... » read more

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tag: KLA-Tencor

Wanted: New Metrology Funding Models

Reaching For The Reset Button In Lithography

Behind The Mask

Capping Tools Tame Electromigration

FD-SOI Foundations Ready, Say Semi Execs

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