tag: Lam Research

AI In Inspection, Metrology, And Test
By Susan Rambo And Ed Sperling - 06 Apr, 2021 - Comments: 0

AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where AI makes sense and where it doesn't. In general, AI works best as a tool in the hands of someone with deep domain expertise. AI can do certain things well, particularly when it comes to pattern m... » read more

What Goes Wrong In Advanced Packages
By Ed Sperling - 24 Mar, 2021 - Comments: 1

Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

EUV Pellicles Finally Ready
By Mark LaPedus - 22 Mar, 2021 - Comments: 0

After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Why New Photoresist Technology Is Critical
By Rich Wise - 18 Mar, 2021 - Comments: 0

As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to transfer chip design to the wafer. That material is rapidly reaching its limit to accurately transfer designs. To keep next-generation device scaling on track, a breakthrough technology has been introduced: dry resist. To better understan... » read more

Chasing After Carbon Nanotube FETs
By Mark LaPedus - 18 Mar, 2021 - Comments: 6

Carbon nanotube transistors are finally making progress for potential use in advanced logic chips after nearly a quarter century in R&D. The question now is whether they will move out of the lab and into the fab. Several government agencies, companies, foundries, and universities over the years have been developing, and are now making advancements with carbon nanotube field-effect transi... » read more

The Future Of Transistors And IC Architectures
By Mark LaPedus - 18 Mar, 2021 - Comments: 1

Semiconductor Engineering sat down to discuss chip scaling, transistors, new architectures, and packaging with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fujimura, CEO of D2S. What follows are excerpt... » read more

SVT: Six Stacked Vertical Transistors
By Coventor - 17 Mar, 2021 - Comments: 0

This paper presents a new design architecture for advanced logic SRAM cells using six vertical transistors (with carrier transport along the Z direction), stacked one on top of each other. Virtual fabrication technology was used to identify different process integration schemes to enable the fabrication of this architecture with a competitive XY footprint at an advanced logic node: a unit cell ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Mar, 2021 - Comments: 0

Government policy For the last four years, the U.S. and China have been embroiled in a trade war, especially on the technology front. The U.S. has implemented a number of export control measures and tariffs in the arena. But there might be a thawing in the tense relationship between the two superpowers. “Reports surfaced Thursday indicating the China Semiconductor Industry Association (CSIA)... » read more

Manufacturing Bits: March 8
By Mark LaPedus - 08 Mar, 2021 - Comments: 0

Two-beam EUV lithography At the recent SPIE Advanced Lithography conference, Nikon gave a presentation on a two-beam extreme ultraviolet (EUV) lithography technology. Still in the conceptual phase, Nikon’s so-called EUV Projection Optical Wafer Exposure Ruling Machine, or EUV Power Machine, is designed for the 1nm node or so. The proposed system has a minimum resolution of 10nm for lines ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Mar, 2021 - Comments: 0

Government policy The National Security Commission on Artificial Intelligence (NSCAI) this week submitted its final report to Congress and the President. The goal is to develop a national strategy to maintain America’s AI advantages related to national security. As part of the long and complex report, the NSCAI came to a sobering conclusion: “The U.S. government is not prepared to defend t... » read more

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